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Newsletter: 13th February 2023
FEATURED
GlobalFoundries and GM reach long-term agreement

General Motors and GlobalFoundries have formed a strategic, long-term agreement establishing a dedicated capacity corridor exclusively for GM’s chip supply

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INDUSTRY NEWS
  Lorentz collaborates with Intel Foundry Services
  Meeting market challenges
  Silicon wafers set new records
  Metrology market to reach $11 billion by 2028

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COMPANY NEWS
  Keysight Technologies focuses on gender equality
  indie to acquire GEO Semiconductor
  Linton Crystal Technologies makes US investment
  onsemi celebrates acquisition

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Brewer Science bonding & dielectric materials deliver packaging solutions for 5G, IoT devices
Semiconductor IC packaging techniques include the utilization of 3D integration to increase chip density, maximize performance and reduce power consumption
INTERVIEWS
  DuPont reshapes IC materials manufacturing for post-COVID success
  Cutting FOPLP pattern distortion
  Critical Manufacturing redefines semiconductor MES
  Brewer Science bonding & dielectric materials deliver packaging solutions for 5G, IoT devices

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LAB NEWS
  POLYN Technology Accepted into Silicon Catalyst Incubator Program
  Tiny Chip-Based Device Performs Ultrafast X-Ray Manipulation
  SFU researchers find the missing photonic link to enable all-silicon quantum internet
  Imec Overcomes Fundamental Operation Challenge for Voltage Controlled RAM

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VIDEO
Edwards Vacuum Interview - Alex Smith

Mark Andrews, Editor of Silicon Semiconductor speaks to Alex Smith, VP of Marketing, Service at Edwards Vacuum looking at the performance, optimisation and efficiency they are working towards.

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NEWSLETTER SPONSOR: EV Group



EV Group

EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices. A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.

With state-of-the-art application labs and cleanrooms at its headquarters in Austria, as well as in North America and Asia.

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