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Newsletter: 20th February 2023
FEATURED
Texas Instruments selects Lehi, Utah

The historic $11 billion investment in manufacturing capacity further extends the company's cost advantage and provides greater control of supply

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INDUSTRY NEWS
  SEMI recognises 'key players'
  SIA calls for 'full funding'
  The History of the GPU: From Inception to AI
  Lorentz collaborates with Intel Foundry Services

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COMPANY NEWS
  Intel launches New Xeon Workstation Processors
  eBook explores automotive design
  ASML publishes 2022 Annual Reports
  Amkor Technology and GlobalFoundries partner

View All Company News


Critical Manufacturing redefines semiconductor MES
Semiconductor manufacture is highly complex
INTERVIEWS
  DuPont reshapes IC materials manufacturing for post-COVID success
  Cutting FOPLP pattern distortion
  Critical Manufacturing redefines semiconductor MES
  Brewer Science bonding & dielectric materials deliver packaging solutions for 5G, IoT devices

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LAB NEWS
  POLYN Technology Accepted into Silicon Catalyst Incubator Program
  Tiny Chip-Based Device Performs Ultrafast X-Ray Manipulation
  SFU researchers find the missing photonic link to enable all-silicon quantum internet
  Imec Overcomes Fundamental Operation Challenge for Voltage Controlled RAM

View All Lab News
VIDEO
Kuehne + Nagel launches semiconductor air freight service

Barry O’Dowd, Global Head of High-Tech at Kuehne+Nagel, discusses the company’s new semiconductor air freight service, with the focus very much on quality, via the new SemiconChain standard, security, visibility and risk mitigation, to deliver a logistics solution that matches the industry’s specialist requirements.

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NEWSLETTER SPONSOR: EV Group



EV Group

EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices. A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.

With state-of-the-art application labs and cleanrooms at its headquarters in Austria, as well as in North America and Asia.

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