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Newsletter: 23rd February 2023
FEATURED
Amkor Technology and GlobalFoundries partner

Partnership expands European and transatlantic semiconductor supply chain

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INDUSTRY NEWS
  SEMI recognises 'key players'
  SIA calls for 'full funding'
  The History of the GPU: From Inception to AI
  Lorentz collaborates with Intel Foundry Services

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COMPANY NEWS
  Brewer Science presents hybrid printed sensors
  Intel launches New Xeon Workstation Processors
  eBook explores automotive design
  ASML publishes 2022 Annual Reports

View All Company News


Brewer Science bonding & dielectric materials deliver packaging solutions for 5G, IoT devices
Semiconductor IC packaging techniques include the utilization of 3D integration to increase chip density, maximize performance and reduce power consumption
INTERVIEWS
  DuPont reshapes IC materials manufacturing for post-COVID success
  Cutting FOPLP pattern distortion
  Critical Manufacturing redefines semiconductor MES
  Brewer Science bonding & dielectric materials deliver packaging solutions for 5G, IoT devices

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LAB NEWS
  POLYN Technology Accepted into Silicon Catalyst Incubator Program
  Tiny Chip-Based Device Performs Ultrafast X-Ray Manipulation
  SFU researchers find the missing photonic link to enable all-silicon quantum internet
  Imec Overcomes Fundamental Operation Challenge for Voltage Controlled RAM

View All Lab News
VIDEO
Women in Semiconductors in the spotlight - An interview with MRL Consulting Group

Lauren Hart, Account Manager Semiconductors at high-tech recruitment specialist MRL Consulting Group, discusses the work of the Women in Semiconductors initiative, following the recent roundtable event in Austin, Texas, which she hosted. She shares some fascinating insights as to how and why the semiconductor industry is so male-dominated, but believes that there are some real opportunities to redress this balance, with Women in Semiconductors leading the way.

www.mrlcg.com

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NEWSLETTER SPONSOR: EV Group



EV Group

EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices. A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.

With state-of-the-art application labs and cleanrooms at its headquarters in Austria, as well as in North America and Asia.

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