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Newsletter: 9th March 2023
FEATURED
Supporting data-intensive workloads

Ayar Labs shipping in-package optical I/O solutions with sub-10 nanoseconds (ns) latency and sub-10 Watts of power needed for leading semiconductor, AI/HPC and aerospace customers to support next-generation data-intensive workloads

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INDUSTRY NEWS
  New signs of price stability and improved availability
  Report highlights plastic additives opportunities
  Guidance for US semiconductor strategy
  Thomas Sonderman to deliver keynote at ISES

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COMPANY NEWS
  EUV Tech and IBM join the eBeam Initiative
  KIOXIA’s major new sustainability initiative
  Stochastics metrology for HVM Fabs
  Quantum Motion raises £42 million

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Start-ups: build up your ecosystem
Two imec experts on both sides of the Atlantic take the pulse of deep-tech venturing
INTERVIEWS
  DuPont reshapes IC materials manufacturing for post-COVID success
  Cutting FOPLP pattern distortion
  Critical Manufacturing redefines semiconductor MES
  Brewer Science bonding & dielectric materials deliver packaging solutions for 5G, IoT devices

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LAB NEWS
  Virtual fab provides sustainable choices
  POLYN Technology Accepted into Silicon Catalyst Incubator Program
  Tiny Chip-Based Device Performs Ultrafast X-Ray Manipulation
  SFU researchers find the missing photonic link to enable all-silicon quantum internet

View All Lab News
VIDEO
A new face for Lynceus

Asmahe Maadi has been appointed as Vice President of Finance and Corporate at Lynceus. She’s excited at the opportunity to help the company develop its presence in the semiconductor industry, thanks to a combination of its AI technology and the expertise and dynamic focus of the staff.

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NEWSLETTER SPONSOR: Malvern Panalytical



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