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Newsletter: 3rd April 2023
FEATURED
Improving yields, cycle times and overall equipment efficiency

Mark Andrews, Technical Editor of Silicon Semiconductor magazine, speaks with David Meyer, Co-Founder and CEO of Lynceus

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INDUSTRY NEWS
  Fab equipment spending on track for 2024 recovery
  Gordon Moore, Intel Co-Founder, dies at 94
  Advanced IC substrates market to reach $1.9 billion
  NTHU signs MoU with the University of Illinois System

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COMPANY NEWS
  ON Partners sees CHIPS and Science Act growth
  Jim Morgan and Lip-Bu Tan receive imec’s Lifetime of Innovation Award
  Pfeiffer Vacuum Offers a New Vacuum Calculator
  Alphawave Semi opens Pune Office

View All Company News


Resilience is critical for supply chain success

INTERVIEWS
  Automotive semiconductors: Changing the face of vehicular electronics
  Resilience is critical for supply chain success
  Customer collaboration crucial for productive change
  DuPont reshapes IC materials manufacturing for post-COVID success

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LAB NEWS
  Jim Morgan and Lip-Bu Tan receive imec’s Lifetime of Innovation Award
  Virtual fab provides sustainable choices
  POLYN Technology Accepted into Silicon Catalyst Incubator Program
  Tiny Chip-Based Device Performs Ultrafast X-Ray Manipulation

View All Lab News
VIDEO
Virtual fab focuses on real carbon footprint reductions

Emily Gallagher, a principal member of the technical staff at imec, discusses the sustainability challenge facing the semiconductor industry and explains how imec’s recently launched Virtual Fab is playing an important role in helping to improve both the understanding and development of environmentally friendly, patterning-related process solutions.

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NEWSLETTER SPONSOR: EV Group



EV Group

EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices. A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.

With state-of-the-art application labs and cleanrooms at its headquarters in Austria, as well as in North America and Asia.

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Providing in-depth analysis and timely reports on the global industry for its 10,000 professional readers in China
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