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Newsletter: 11th May 2023
FEATURED
Global semiconductor sales decrease 8.7%

The Semiconductor Industry Association (SIA) has announced worldwide sales of semiconductors totaled $119

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INDUSTRY NEWS
  ASML and Eindhoven University of Technology strengthen longstanding collaboration
  Resilinc partners with SEMI on supply chain resilience
  MIT engineers “grow” atomically thin transistors on top of computer chips
  Wafer fab equipment - facing uncertain times?

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COMPANY NEWS
  ASML and Eindhoven University of Technology strengthen longstanding collaboration
  MBE system order for industrial semiconductor markets
  Eyelit’s expansion fuelled by contract wins and MESTEC acquisition
  Resilinc partners with SEMI on supply chain resilience

View All Company News


Automotive semiconductors: Changing the face of vehicular electronics
The market for automotive semiconductors is expected to grow at a rate of over 9% annually through 2030
INTERVIEWS
  Automotive semiconductors: Changing the face of vehicular electronics
  Improving yields, cycle times and overall equipment efficiency
  Resilience is critical for supply chain success
  Customer collaboration crucial for productive change

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LAB NEWS
  ASML and Eindhoven University of Technology strengthen longstanding collaboration
  Purdue, imec, Indiana announce partnership
  MIT engineers “grow” atomically thin transistors on top of computer chips
  Leti Innovation Days to explore microelectronics’ transformational role

View All Lab News
VIDEO
Fully customisable and configurable 64-bit RISC-V cores

Roger Espasa, CEO of SemiDynamics, discusses the technology behind the company’s fully configurable 64-bit, RISC-V processor IP, the recent launch of the Atrevido core – the first in a fully customisable 64-bit RISC-V family of cores, focusing on demanding machine learning and AI applications.

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NEWSLETTER SPONSOR: EV Group



EV Group

EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices. A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.

With state-of-the-art application labs and cleanrooms at its headquarters in Austria, as well as in North America and Asia.

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Volume 2023 - Issue 4/5
Providing in-depth analysis and timely reports on the global industry for its 10,000 professional readers in China
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