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Newsletter: 8th June 2023
FEATURED
Fab scheduling is now so complex that it needs next-generation intelligent software

There are literally billions of possible ways to schedule all the work through a fab, so finding the best way is an immense challenge

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INDUSTRY NEWS
  Big Data Analytics to reach USD 47.2 billion by 2031
  Global semiconductor manufacturing equipment market to reach $143.9 billion
  Researchers finds a way to reduce the overheating of semiconductor devices
  Forging a dream material with semiconductor quantum dots

View All Industry News
COMPANY NEWS
  Intellias and Elmos Semiconductor join for automotive solutions
  Mouser extends its microcontroller line-up
  Accelerating Ai innovation
  Greene Tweed breaks ground on new facility in Korea

View All Company News


Why ‘silicon proven’ is not what you think
Agile Analog’s approach to analog IP design and quality
INTERVIEWS
  The perfect partner for wet process equipment?
  Virtual fab focuses on real carbon footprint reductions
  Automotive semiconductors: Changing the face of vehicular electronics
  Improving yields, cycle times and overall equipment efficiency

View All Interviews
LAB NEWS
  Researchers finds a way to reduce the overheating of semiconductor devices
  CEA-Leti to reports on next-generation LiDAR steering
  Forging a dream material with semiconductor quantum dots
  GlobalFoundries, Samsung Electronics, and TSMC join Imec’s “Sustainable Semiconductor Technologies & Systems” (SSTS) Program

View All Lab News
VIDEO
Research program promises a more sustainable future

Cedric Rolin, Program Manager of imec's Sustainable Semiconductor Technology and Systems (SSTS) program, explains the impact of GlobalFoundries, Samsung and TMSC joining the research program, discusses the work that's been done to date and planned future projects, as well as discussing the wider context of sustainability in the semiconductor industry – what it should look like and what can be achieved.

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NEWSLETTER SPONSOR: EV Group



EV Group

EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices. A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.

With state-of-the-art application labs and cleanrooms at its headquarters in Austria, as well as in North America and Asia.

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Silicon Semiconductor China
Volume 2023 - Issue 4/5
Providing in-depth analysis and timely reports on the global industry for its 10,000 professional readers in China
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