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Newsletter: 16th June 2023
FEATURED
Asia takes center stage

Nanometer chips redefining semiconductor industry landscape, says GlobalData

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INDUSTRY NEWS
  Big Data Analytics to reach USD 47.2 billion by 2031
  Global semiconductor manufacturing equipment market to reach $143.9 billion
  Researchers finds a way to reduce the overheating of semiconductor devices
  Forging a dream material with semiconductor quantum dots

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COMPANY NEWS
  SiMa.ai launches Partner Program
  Fractilia adds overlay metrology capability
  Driving next-generation automotive V2X applications
  Greene Tweed breaks ground on Korean facility

View All Company News


Government support for the microchip industry – a perspective from Flanders
Over many decades the US, EU and UK have all been reliant on microchips from Taiwan and China
INTERVIEWS
  The perfect partner for wet process equipment?
  Virtual fab focuses on real carbon footprint reductions
  Automotive semiconductors: Changing the face of vehicular electronics
  Improving yields, cycle times and overall equipment efficiency

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LAB NEWS
  Researchers finds a way to reduce the overheating of semiconductor devices
  CEA-Leti to reports on next-generation LiDAR steering
  Forging a dream material with semiconductor quantum dots
  GlobalFoundries, Samsung Electronics, and TSMC join Imec’s “Sustainable Semiconductor Technologies & Systems” (SSTS) Program

View All Lab News
VIDEO
Women in Semiconductors – Laura Silverstein, GlobalFoundries

Laura Silverstein, Technology Development Integration Engineer at GlobalFoundries’ Essex Junction, Vermont facility, was recently recognised as GF’s DEI in Inventorship Champion – awarded for hard work in creating a new and more diverse generation of inventors. Silicon Semiconductor Editor, Philip Alsop, finds out more about her career to date, her current role at the company and her thoughts on diversity, equality and inclusivity in the semiconductor industry.

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NEWSLETTER SPONSOR: EV Group



EV Group

EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices. A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.

With state-of-the-art application labs and cleanrooms at its headquarters in Austria, as well as in North America and Asia.

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Silicon Semiconductor China
Volume 2023 - Issue 4/5
Providing in-depth analysis and timely reports on the global industry for its 10,000 professional readers in China
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