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Newsletter: 23rd June 2023
FEATURED
Lockheed Martin And GlobalFoundries collaborate



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INDUSTRY NEWS
  Advancing workforce development collaborations
  Asia takes center stage
  Big Data Analytics to reach USD 47.2 billion by 2031
  Global semiconductor manufacturing equipment market to reach $143.9 billion

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COMPANY NEWS
  Advancing workforce development collaborations
  See the invisible semiconductor world
  Advancing Silicon Spin Qubit Research for Quantum Computing
  COO Masao Hodai visits EBARA’s Dresden site

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Green Goals. Yellow Solutions.
Sustainability and environmental health are in our DNA. BATCHSPRAY® technology delivers energy-, media- and water-saving processes throughout the chip manufacturing cycle. With two decades of experience in batch spray and its hardware, Siconnex has grown to be the leading supplier of sustainable wet processing equipment.
INTERVIEWS
  The perfect partner for wet process equipment?
  Virtual fab focuses on real carbon footprint reductions
  Automotive semiconductors: Changing the face of vehicular electronics
  Improving yields, cycle times and overall equipment efficiency

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LAB NEWS
  Advancing Silicon Spin Qubit Research for Quantum Computing
  Making the most of microscanners
  Increasing yield in chip production
  Extending Moore’s Law

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VIDEO
Women in the semiconductor industry: Nerissa Draeger, Director of Global University Engagements at Lam Research

Nerissa Draeger, Director of Global University Engagements at Lam Research, discusses her work in the semiconductor industry, sharing many valuable insights as to the ways in which diversity, equality and inclusion are now a critical part of her company’s DNA, as well as discussing this topic from a wider semiconductor industry perspective.

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NEWSLETTER SPONSOR: EV Group



EV Group

EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices. A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.

With state-of-the-art application labs and cleanrooms at its headquarters in Austria, as well as in North America and Asia.

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Silicon Semiconductor China
Volume 2023 - Issue 4/5
Providing in-depth analysis and timely reports on the global industry for its 10,000 professional readers in China
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