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Newsletter:
19th July 2023
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US partnership with Costa Rica
The US State Department will partner with the Government of Costa Rica to explore opportunities to diversify and grow the global semiconductor ecosystem and create a more resilient, secure, and sustainable global semiconductor value chain. This partnership is enabled by the International Technology Security and Innovation Fund (“ITSI” Fund), created by the CHIPS Act of 2022.
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From processing and computing to sensing
Photons are getting closer than ever to processing cores and, in some cases, can even be used for processing. When you add machine learning to advanced integrated photonic circuits, you get a new generation of sensors for medical, environmental, and food manufacturing applications. Eléonore Hardy, Business Developer, CEA-Leti & Deputy-Director of IRT Nanoelec Photonic Sensors Program, provides a fascinating and informative overview of the recent CEA-Leti Innovation Days’ Photonics: Data and Sensing Workshop.
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NEWSLETTER SPONSOR: HORIBA
Free Webinar - Now available to view on-demand
Multimodal Spectroscopic Characterization of Large Semiconductor Wafers
The simultaneous need to increase performance and reduce cost for today's semiconductor devices means using ever larger wafers, while reducing the size of device structures, thereby increasing their complexity. This combination of requirements means the metrology tools for characterizing such wafers need to evolve to handle such large wafers – up to 300 mm in diameter. At the same time, these tools need to increase in sophistication to unravel the complexity in the ever-smaller device structures.
In this webinar, we will present:
- Multimodal spectroscopy metrology tools capable of high spatial and spectral resolution analysis of up to 300 mm semiconductor wafers.
- Some of the challenges involved in working with large wafers, and how our solutions address these challenges.
- We will show how the proposed solutions enable the use of various spectroscopic modalities to characterize important wafer and device parameters such as uniformity, stress & strain, defects, doping and contamination distribution, carrier dynamics and overall quality control.
Our platforms can accommodate up to 8 spectroscopic modalities, including Raman, Photoluminescence and Time-Resolved Photoluminescence amongst others. And with sub-micron spatial resolution, these tools can resolve most of the common defect structures of interest in semiconductor devices as well provide various insights into carrier dynamics.
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| Silicon Semiconductor China |
Volume 2023 - Issue 4/5
Providing in-depth analysis and timely reports on the global industry for its 10,000 professional readers in China
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Silicon Semiconductor magazine delivers keen insight into new and evolving technologies, and how they shape tomorrow's futures, and fortunes.
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AngelTech 2024 • 16th - 17th April 2024 • Brussels, Belgium
Comprising of CS International (celebrating its 13th anniversary), PIC International (now in its 8th year),
and Power Electronics (PE) International (now in its 2nd year).
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