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Newsletter: 17th August 2023
FEATURED
Intel and Synopsys expand partnership

Agreement will allow designers to realize the advantages of Intel 3 and Intel 18A process technologies and to bring differentiated products to market.


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INDUSTRY NEWS
  Huge market potential
  CHIPS Act anniversary celebration
  University of Sheffield professor to help grow UK semiconductor sector
  JV to bring advanced manufacturing to Europe

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COMPANY NEWS
  Mouser Electronics and Analog Devices support tree planting initiative
  NRS Logistics to build US distribution facility
  Brewer Science expands Vichy Manufacturing Center
  Greene Tweed introduces Chemraz G57 Premium Elastomer

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The benefits of AI to the semiconductor industry supply chain
A Q and A with Skyler Chi, Head of Enterprise Accounts, Exiger, discussing the impact of AI on the microelectronics manufacturing supply sector, the benefits it can provide and offering some advice as to how best to integrate the technology into supply chain operations.
INTERVIEWS
  The potential of AI
  Current scenario of the semiconductor wafer industry
  Playing politics: The semiconductor supply chain
  A hybrid approach optimises semiconductor process development

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LAB NEWS
  Unlocking the potential of thin-film sensors in infrared imaging
  ASU and TSMC partner on workforce and research innovation
  Collaboration helps hearing aid innovation
  Zone-based automotive E /E – new architectures required

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VIDEO
Exploring the intricacies of IC packaging and assembly services

Dick Otte, CEO, and Rosie Medina, Vice President, Sales and Marketing, both at QP Technologies, discuss how the company helps its customers with a range of semiconductor technology solutions, covering wafer preparation, advanced assembly and design, IC packaging and assembly, substrate development and the emerging chiplet packaging opportunity.

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NEWSLETTER SPONSOR: SPEA



SPEA supplies Automatic Test Equipment to save up to 90% on the Cost of Test

Established in 1976, SPEA is a world-leading company in the field of automatic test equipment for ICs, MEMS, sensors, electronic boards, and batteries. The company has recently inaugurated a ground-breaking approach in the test architecture design, introducing an entirely new mixed-signal test platform called DOT (Device-Oriented Tester).

The innovative architecture has proven on the field to bring savings on the cost of test per device that often exceed 60% (going up to 90% savings in the best cases), on several challenging applications such as BMS, SerDes, OpAmp, PMIC, MEMS and sensors, Microcontrollers, Converters.

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Silicon Semiconductor China
Volume 2023 - Issue 4/5
Providing in-depth analysis and timely reports on the global industry for its 10,000 professional readers in China
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