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Newsletter: 30th August 2023
FEATURED
2024 recovery remains on track

Downcycle to end as 2024 recovery anticipated.


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INDUSTRY NEWS
  Huawei and Ericsson sign cross-licensing agreement
  IDTechEx discusses chips as currency
  Wafer market gears up for 'stunning' growth
  Arizona's top talent pipeline

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COMPANY NEWS
  SK hynix develops 'best performing' HBM3E
  Huawei and Ericsson sign cross-licensing agreement
  Winbond completes first renewable energy procurement
  Smarter, more efficient IoT

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How advanced cleaning helps achieve optimal wafer yields at advanced semiconductor nodes
With the introduction of SAPS and TEBO technology in a megasonic system, semiconductor manufacturers now have new tools in their fight to achieve optimal wafer yields. By ACM Research.
INTERVIEWS
  The potential of AI
  Current scenario of the semiconductor wafer industry
  Playing politics: The semiconductor supply chain
  A hybrid approach optimises semiconductor process development

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LAB NEWS
  U of A takes next leadership step
  Unlocking the potential of thin-film sensors in infrared imaging
  ASU and TSMC partner on workforce and research innovation
  Collaboration helps hearing aid innovation

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VIDEO
Interview with VEDP

VEDP President and CEO, Jason El Koubi, discusses the recent launch of the Virginia Alliance for Semiconductor Technology, with its focus on skills development alongside research collaboration, to be delivered by the state’s network of universities and other academic institutions. He goes on to explain the other ways in which VEDP is engaging with the semiconductor industry, both in the US and overseas, to grow its presence within Virginia.

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NEWSLETTER SPONSOR: EV Group



EV Group

EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices. A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.

With state-of-the-art application labs and cleanrooms at its headquarters in Austria, as well as in North America and Asia.

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Silicon Semiconductor China
Volume 2023 - Issue 4/5
Providing in-depth analysis and timely reports on the global industry for its 10,000 professional readers in China
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