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Newsletter:
29th September 2023
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200mm fabs to reach record capacity by 2026
Semiconductor manufacturers worldwide are projected to increase 200mm fab capacity by 14% from 2023 through 2026, adding 12 new 200mm volume fabs (excluding EPI) as the industry reaches a record high of more than 7.7 million wafers per month (wpm), SEMI announced in its 200mm Fab Outlook to 2026 report.
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New developments in underlayers and their role in advancing EUV lithography
Extreme ultraviolet (EUV) lithography is used to pattern the smallest
features in advanced semiconductor devices. The demand for smaller
devices with more capabilities requires industry innovation in EUV
processes and materials.By Joyce Lowes, Director, Emerging Materials Technology, Corporate Research and Development, Brewer Scientific.
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VIDEO
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Diversity and AI can address the semiconductor skills crisis
Gloria Kee, Vice President of Product Management at Model N, discusses the semiconductor indust...
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NEWSLETTER SPONSOR: EV Group
EV Group
EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices. A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.
With state-of-the-art application labs and cleanrooms at its headquarters in Austria, as well as in North America and Asia.
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| Silicon Semiconductor China |
Volume 2023 - Issue 4/5
Providing in-depth analysis and timely reports on the global industry for its 10,000 professional readers in China
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