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Newsletter:
20th October 2023
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Advanced X-ray technology for advanced packaging
While X-ray technology in the semiconductor industry was considered
too inaccurate, too slow, and too expensive a short time ago, new
developments in micro-CT, sophisticated trajectories, and smart
algorithms are delivering a non-destructive inspection method that is
helping manufacturers with their zero-defect strategy taking their
productivity and profitability to a new level.
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VIDEO
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Volkswagen Group reorganises semiconductor procurement strategy
Karsten Schnake, Board Member for Procurement at Å koda Auto and head of the Volkswagen Groupâ€...
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NEWSLETTER SPONSOR: EV Group
EV Group
EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices. A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.
With state-of-the-art application labs and cleanrooms at its headquarters in Austria, as well as in North America and Asia.
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| Silicon Semiconductor China |
Volume 2023 - Issue 8/9
Providing in-depth analysis and timely reports on the global industry for its 10,000 professional readers in China
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Silicon Semiconductor magazine delivers keen insight into new and evolving technologies, and how they shape tomorrow's futures, and fortunes.
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AngelTech 2024 • 16th - 17th April 2024 • Brussels, Belgium
Comprising of CS International (celebrating its 13th anniversary), PIC International (now in its 8th year),
and Power Electronics (PE) International (now in its 2nd year).
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