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Newsletter: 23rd November 2023
FEATURED
CMC Microsystems and ventureLAB sign MoU

CMC Microsystems, a not-for-profit organization that accelerates research and innovation in advanced technologies in Canada, and ventureLAB, leading global founder community for hardware technology and enterprise software companies in Canada, have signed a Memorandum of Understanding (MOU) to formalize their relationship and advance Canada’s advanced technology ecosystem.


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INDUSTRY NEWS
  Report highlights opportunities for UK tech across Taiwan’s semiconductor sector
  Semiconductor giants add $1.1 trillion to stock values
  Imec.xpand launches EUR 300m fund
  Conference spotlights the latest Microelectronics Packaging Technologies

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COMPANY NEWS
  FTD solutions unveils Water Management as a Service
  Boosting smartphone performance
  Trident IoT launches Taurus Z-Wave Series silicon
  mechatronic systemtechnik unveils Fürnitz Technology Centre

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INTERVIEWS
  The path to power-efficient processing
  AP&S arrives in the US market
  Imec investigates the scope for sustainability improvements
  The importance of digital in creating a more sustainable future

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LAB NEWS
  CEA-Leti to report on latest packaging research
  CEA-Leti to coordinate 6G EU projects
  Quantum processor testing and measurement facilities up and running
  Manufacturing innovation centre focuses on electrification

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VIDEO
Semiconductor industry set to deliver a sustainable, digital future

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NEWSLETTER SPONSOR: Comet Yxlon



High-resolution 3D X-ray

With advanced computed laminography and integrated AI technology, Comet Yxlon brings high-resolution 3D X-ray capabilities to the forefront for detailed testing in the advanced packaging of integrated circuits. Finally, the semiconductor market now has a non-destructive supplement or alternative to conventional destructive methods. Three-dimensional X-ray images with a resolution of less than 1 µm can reliably identify typical defects in 3D IC solder connections, such as missing and bridged bumps, voids, non-wet, head-in-pillow, bump shift, or deformations. Deep-learning analysis software takes over the automatic evaluation. The CA20 system offers the semiconductor industry a whole new level of safety and efficiency.

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