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Newsletter:
27th March 2024
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Leveraging AI to efficiently test AI chips
The semiconductor devices that bring artificial intelligence (AI)
and machine learning (ML) to the cloud as well as to the edge present
significant test challenges. The semiconductor test industry is well
positioned to address these challenges by leveraging AI and ML
techniques to analyze and correlate data across the entire semiconductor
value chain.
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VIDEO
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Initiative makes major curvilinear mask making progress
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NEWSLETTER SPONSOR: EV Group
EVG®850 NanoCleave™ Layer Release System
EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices. A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and metrology systems.
EVG’s Heterogeneous Integration and NILPhotonics® Competence Centers provide an open access innovation incubator for customers and partners across the microelectronics supply chain.
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| Silicon Semiconductor China |
Volume 2024 - Issue 12/01
Providing in-depth analysis and timely reports on the global industry for its 10,000 professional readers in China
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AngelTech 2024 • 16th - 17th April 2024 • Brussels, Belgium
Comprising of CS International (celebrating its 13th anniversary), PIC International (now in its 8th year),
and Power Electronics (PE) International (now in its 2nd year).
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