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Newsletter:
7th June 2024
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Chasing the swarm: the new challenge for chip manufacturers
From the geopolitical sparring of China and
the US to the global supply chain upon which we all depend, those
watching the worldwide semiconductor market will be witnessing an
ever-changing environment – and one that’s now never far from the news. By Mark Lippett, CEO, XMOS
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VIDEO
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Best practices to grow, leverage and protect a semiconductor IP portfolio
Sunstein LLP Partner Shane Hunter, who leads the firm’s Semiconductor & Microelectronics Group, discusses the implicat...
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NEWSLETTER SPONSOR: EV Group
EVG®850 NanoCleave™ Layer Release System
EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices. A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and metrology systems.
EVG’s Heterogeneous Integration and NILPhotonics® Competence Centers provide an open access innovation incubator for customers and partners across the microelectronics supply chain.
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| Silicon Semiconductor China |
Volume 2024 - Issue 04/05
Providing in-depth analysis and timely reports on the global industry for its 10,000 professional readers in China
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AngelTech 2025 • 8th - 9th April 2025 • Brussels, Belgium
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