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Newsletter: 16th July 2024

 
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FEATURED
Biden-Harris Administration to invest up to $1.6 billion

The U.S. Department of Commerce has issued a Notice of Intent (NOI) to open a competition for new research and development (R&D) activities that will establish and accelerate domestic capacity for semiconductor advanced packaging.


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INDUSTRY NEWS
  Adeia wins ECTC Award for paper on “Fine Pitch Die-to-Wafer Hybrid Bonding”
  Sydney council forges vital semiconductor agreement
  EMD Electronics network leaders honoured
  Deep learning chipset market to surge to $72.8 billion by 2033

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COMPANY NEWS
  Adeia wins ECTC Award for paper on “Fine Pitch Die-to-Wafer Hybrid Bonding”
  AEM introduces new generation of Automated Burn-In Systems
  EV Group's EVG880 LayerRelease wins 2024 Best of West
  Cyient sets up subsidiary for semiconductor business

View All Company News

Sparking change in silicon semiconductor manufacturing with green energy
In the ever-evolving tech landscape, few industries rival the energy demands of silicon semiconductor manufacturing. These energy-intensive businesses are the backbone of modern electronics, powering everything from smartphones to supercomputers. However, this vital sector faces a pressing dilemma: the soaring costs of energy amidst a global climate crisis.
INTERVIEWS
  Magnetic memory research partnership
  CEA-Leti announces launch of FAMES pilot line as part of EU Chips Act initiative
  SEMICON WEST PREVIEW – AXUS TECHNOLOGY
  SEMICON West - 'Stronger together'

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LAB NEWS
  CEA-Leti launches FAMES Pilot Line
  CEA-Leti presents complementary developments in 3D Integration Technologies
  Imec introduces 'best-in-class' ADCs
  Imec demonstrates functional monolithic CFET devices with stacked bottom and top contacts

View All Lab News
VIDEO
Transforming EBL into a volume-production system for emerging applications

Kenneth MacWilliams, Multibeam President, explains the company’s new MB platform – a multicolumn E-Beam Lithography ...

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