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Newsletter:
27th August 2024
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Texas Instruments signs preliminary CHIPS Act agreement
Proposed $1.6 billion funding, coupled with an estimated $6 billion to $8 billion in investment tax credit, will help TI provide geopolitically dependable, 300mm capacity for analog and embedded processing semiconductors in Texas and Utah.
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VIDEO
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Wafer bonding moves front and centre
Thomas Uhrmann, director of business development, EV Group, discusses why and how wafer bonding is no longer simply a back-end integration process but now a front-end manufacturing process as well, how the company is working with lithography and other technology partners as part of this new focus, and also outlines the work being done on advanced packaging and future scaling collaboration.
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NEWSLETTER SPONSOR: EV Group
EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices. A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and metrology systems.
EVG’s Heterogeneous Integration and NILPhotonics® Competence Centers provide an open access innovation incubator for customers and partners across the microelectronics supply chain.
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| Silicon Semiconductor China |
Volume 2024 - Issue 08/09
Providing in-depth analysis and timely reports on the global industry for its 10,000 professional readers in China
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AngelTech 2025 • 8th - 9th April 2025 • Brussels, Belgium
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and Power Electronics (PE) International (now in its 3rd year).
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