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Newsletter:
11th November 2024
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Splitting hairs to ten to the power of four
14ACMOS: EU project for the next technology node in
semiconductor manufacturing.
By Mathias Winter, Head of Piezo Drives & Systems
Technology, Global Research and Markus Wiederspahn, Corporate Communications,
PHYSIK INSTRUMENTE L.P. (PI).
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VIDEO
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AI power delivery for the data centre
Tim Phillips, founder and CEO of Empower Semiconductor, explains how AI performance and power consumption are outpacing improvements in power delivery within the data centre, hence the company has developed the FinFast-based Crescendo vertical power platform to enable higher-performance computing with industry-leading power density, speed
and unmatched efficiency.
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NEWSLETTER SPONSOR: ULVAC
Replace Your Old Legacy Ashing Systems
See us at Europa Booth 453 C1
The production proven ULVAC Enviro Optima resist strip system replaces up to 6 legacy ashing tools. It provides the highest throughput per square meter of clean-room space at the lowest CoO. At >12µm/min ashing rate and 245 WPH, Optima utilizes the latest ashing technology featuring a remote ICP plasma source for ultra-high throughput. The system is configurable for 100mm – 300mm wafers.
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| Silicon Semiconductor China |
Volume 2024 - Issue 08/09
Providing in-depth analysis and timely reports on the global industry for its 10,000 professional readers in China
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