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Newsletter: 14th February 2025

 
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Fujifilm to invest 4 billion yen in Belgium

FUJIFILM Corporation will install new production facilities of CMP slurries, advanced semiconductor materials, and enhance existing facilities for photolithography-related materials at its production site located in Belgium.


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INDUSTRY NEWS
  Photonic Integrated Circuit market to surpass $50B by 2035
  North American semiconductor industry 'unites'
  Extended reality class prepares students for semiconductor industry
  Worldwide semiconductor revenue grew 18% in 2024
  UB researchers mix silicon with 2D materials for new semiconductor tech

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COMPANY NEWS
  Aitomatic's DXA Factory Platform to power next billion AI agents
  ERS electronic opens Advanced Packaging facility
  Advantest unveils T5801 Ultra-High-Speed Memory Test System
  SK hynix acquires 'TISAX' Certification
  SurplusGLOBAL launches AI-powered Global Platform 'SemiMarket'

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Empowering semiconductor manufacturers to embrace new markets
Reduction of outgassing and elimination of contaminants is a pressing need for an industry spanning a wide variety of new markets. By Jason Davis, New Business Development, Junkosha USA Inc.
INTERVIEWS
  Imec proposes double-row CFET for the A7 technology node
  EHD printhead promises semiconductor packaging revolution
  Testing times for silicon photonics?
  A modern MES - a must have for the semiconductor sector

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LAB NEWS
  LQDX and Arizona State University sign semiconductor packaging collaboration agreement
  MACOM European Semiconductor Centre (MESC) wins contract
  CEA-Leti announces FAMES Pilot Line in Nature Reviews Electrical Engineering
  UB researchers mix silicon with 2D materials for new semiconductor tech
  New chip to solve quantum computing roadblocks

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VIDEO
Control and connectivity solutions for global semiconductor equipment manufacturers

Marc Engel, CEO of Agileo Automation with headquarters in Poitiers, France, talks us through the company’s new E84 PIO Box, a handheld device offering a new lightweight interface for fab staff to test semiconductor equipment software for compliance with SEMI’s E84 and GEM300 standards suite for automatic carrier delivery. It improves the readability, identification, and validation of E84 signal exchanges and functional aspects in cleanrooms or workshops. The E84 PIO Box is designed to rigorously validate nominal and error cases, ensuring seamless operations and fast recovery, benefiting both equipment manufacturers and facilities alike. Agileo is a key contributor to the development and integration of industry standards such as SEMI standards and OPC Unified Architecture (OPC-UA).

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NEWSLETTER SPONSOR: PIC International 2025



PIC International 2025


The PIC International conference is designed to connect, educate, and inspire professionals in the photonic integrated circuit (PIC) industry. Now in its 10th year, the event builds on the success of previous conferences, featuring approximately 30 experts from industry and academia presenting on four key themes. Attendees will explore topics such as: driving data innovation with AI, machine learning, and next-generation computing; optimizing materials and architectures to advance PICs; progressing quantum 2.0 technologies with PICs; and leveraging PICs in healthcare, autonomous vehicles, and other emerging fields. To discover our sponsorship and exhibition opportunities, contact us at: Email: info@picinternational.net Phone: +44 (0)24 7671 8970 Media pack: https://picinternational.net/sponsorship

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Silicon Semiconductor China
Volume 2025 - Issue 12/01
Providing in-depth analysis and timely reports on the global industry for its 10,000 professional readers in China
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