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Newsletter:
26th February 2025
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NXP to acquire edge AI pioneer Kinara
Enhances NXP's leading processing portfolio with cutting edge NPUs and AI software, driving intelligent system solutions across the industrial and automotive edge markets.
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VIDEO
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Holistic approach to hyper-efficient data movement in agile complex silicon systems
Nandan Nayampally, Chief Commercial Officer at Baya Systems, discusses how, to better support AI and other compute-heavy and data-intensive applications, the company offers a holistic approach to design, analyse and build complex, highly performant multi-die systems that overcome traditional semiconductors’ bottlenecks of data movement and scalability. Baya’s performance-focused, software-based approach, coupled with its unique transport and modular fabric IP, is designed from the ground up to produce complex multi-die solutions that are correct by construction with a simplified design process.
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NEWSLETTER SPONSOR: ULVAC
Advanced Plasma Resist Strip System
The ENVIRO-1Xa photoresist removal equipment from ULVAC, offers superior performance at an exceptional price. The system can handle multiple wafer sizes, ranging from 100 to 200 mm in diameter. The system utilizes a high efficiency downstream plasma source and can achieve ash rates >10µm/min, with a throughput of 70+wph. This is all achieved on a minimal footprint of 1.57m2. It offers high process flexibility that is required for demanding processes, such as: high-dose implanted resist removal, descum and surface modification, SU-8 and fluorinated resist removal, and MEMS sacrificial-layer removal.
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| Silicon Semiconductor China |
Volume 2025 - Issue 12/01
Providing in-depth analysis and timely reports on the global industry for its 10,000 professional readers in China
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