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Newsletter: 4th March 2025

 
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FEATURED
Synopsys expands Hardware-Assisted Verification Portfolio

New Synopsys Emulation and Prototyping Ready (EP-Ready) Hardware enables configuration for emulation and prototyping use-cases within and across multiple projects on a single hardware platform.


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INDUSTRY NEWS
  Automated electronics disassembly
  SEMICON Southeast Asia 2025 celebrates 30 years of innovation through collaboration
  EMEA Big Data Analytics to hit $5,756.5 million by 2027
  3D Semiconductor Packaging market to reach US$ 43.6 billion by 2034
  Semiconductors set for a $95 billion boom in 2025

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COMPANY NEWS
  Improved gaming, connectivity and AI performance
  Aeluma appoints former NVIDIA finance leader Mike Byron to Board of Directors
  Svein-Egil Nielsen joins Nanopower as chair of the board
  Salience Labs closes Series A Round
  MESI 4.0 Summit 2025: Global manufacturers reunite to accelerate digital transformation

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Evolving the semiconductor industry with AI and simulation
It’s no secret that the semiconductor industry has been in a state of flux since generative AI exploded into the mainstream. And as adoption of both AI models, and AI-powered smart products, continues to increase, so will the already extreme demand for semiconductor chips. By Mazen El Hout, Senior Product Marketing Manager, Ansys
INTERVIEWS
  SMU optimised for testing emerging nano/2D semiconductor devices
  Custom cable solution for semiconductor manufacturing sliding components
  Optimism overrides any causes for concern
  Advancing semiconductor research thanks to thermal property measurement

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LAB NEWS
  Imec demonstrates electrical yield for 20nm pitch metal lines obtained with High NA EUV single patterning
  3D Semiconductor Packaging market to reach US$ 43.6 billion by 2034
  Chip-based system for terahertz waves could enable more efficient, sensitive electronics
  Breakthrough microactuator driving system
  EU funding boosts Europe's semiconductor production

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VIDEO
Holistic approach to hyper-efficient data movement in agile complex silicon systems

Nandan Nayampally, Chief Commercial Officer at Baya Systems, discusses how, to better support AI and other compute-heavy and data-intensive applications, the company offers a holistic approach to design, analyse and build complex, highly performant multi-die systems that overcome traditional semiconductors’ bottlenecks of data movement and scalability. Baya’s performance-focused, software-based approach, coupled with its unique transport and modular fabric IP, is designed from the ground up to produce complex multi-die solutions that are correct by construction with a simplified design process.

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Silicon Semiconductor China
Volume 2025 - Issue 12/01
Providing in-depth analysis and timely reports on the global industry for its 10,000 professional readers in China
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