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Newsletter: 1st April 2025

 
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FEATURED
Microchips: EU off the pace in a global race

The target of 20 % global market share by 2030 appears out of reach.


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INDUSTRY NEWS
  Trump’s semiconductor tariffs threaten to affect US medical device industry growth
  2025 IEEE ECTC highlights microelectronics packaging and component breakthroughs
  The Northeast Microelectronics Coalition awards $1.43 million to 19 semiconductor companies
  Exploring packaging technologies
  AI tops tech growth charts

View All Industry News
COMPANY NEWS
  Critical Manufacturing and Twinzo partner
  Infineon at PCIM Europe 2025
  Renesas debuts new Group in popular RA0 Series
  Arteris wins two Gold and One Silver Stevie Awards
  TechInsights appoints Dan Kim as Chief Strategy Officer

View All Company News
INTERVIEWS
  Partnership drives supplier resilience and agility
  CHIPDIPLO project seeks to strengthen European semiconductor industry
  Crescendo increases power density possibilities
  Closing the refurbishment gap and moving toward a more circular, responsible supply chain

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LAB NEWS
  Smart and compact sensors with Edge-AI
  Imec pioneers photonic code-division multiplexing FMCW 144GHz distributed radar
  Baden-Württemberg attracts imec to lead development of chiplet-based technology
  Collaborative EU Project set to deliver breakthrough in Space Imaging Sensing
  Device enables direct communication among multiple quantum processors

View All Lab News
VIDEO
NIL and MEMS - a powerful combination

Thomas Achleitner, Business Development Manager at EV Group, gives us a preview of the paper he is presenting at the forthcoming AngelTech event: ‘Leveraging NIL for µLED Lens Packaging’, explaining why NIL is particularly suited for this application, and other process steps that NIL could cover. He also explains about the company’s NIL Photonic Competence Center and talks through the recently launched next-generation version of its GEMINI automated production wafer bonding system for 300-mm wafers.

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NEWSLETTER SPONSOR: Broadcom & EBV



Delivering a Maintenance-Free Feedback Solution with Battery-less Energy Harvesting Encoder

Online - 3rd June 2025 - 3PM UK


Presenting energy harvesting technology and highlighting Broadcom's AS20-M42M series absolute encoder: Battery-less multi-turn counter integrated to a magnetic single-turn ASIC. The innovative solution is packed into a miniature 20mm diameter with built-in protocol options: SPI/SSI/BiSS-C/RS485. Key Takeaways include:

  1. Discover the benefits of miniature energy harvesting magnetic encoders and learn how to effectively calibrate them for optimal performance.
  2. Gain insights into the latest integrated magnetic hall and Wiegand sensing product technologies and trends, and learn how to choose the best products for your specific application needs.
  3. Learn how to accelerate your innovation and transform to the digital positional feedback by leveraging the latest encoder product advancements and best practices.


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Silicon Semiconductor China
Volume 2025 - Issue 12/01
Providing in-depth analysis and timely reports on the global industry for its 10,000 professional readers in China
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