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Newsletter: 3rd April 2025

 
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£9 million funding boost to bring key semiconductor manufacturing capability to Scotland

New development could cut chip packaging process from months to just days for UK firms.


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INDUSTRY NEWS
  PCIM Asia Shanghai 2025: Bringing together the Asian power electronics community
  FAMES Pilot Line launches open-access call for chip industry
  Strengthening Europe‘s semiconductor future
  CHIPDIPLO consortium selected to support international diplomacy in semiconductors
  Nvidia now holds 7.3% of the semiconductor market

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COMPANY NEWS
  iPronics unveils World’s silicon photonics optical circuit switch
  Marvell demonstrates silicon photonics light engine
  Arteris opens new Engineering Hub in Poland
  High-accuracy packaging in panel level packaging
  PhotonDelta and Silicon Catalyst form strategic collaboration

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Europe’s semiconductor industry focuses on sustainable growth
Laith Altimime, President of SEMI Europe, discusses the challenges and opportunities facing the European semiconductor industry. Laith talks sustainability, collaboration, technology innovation, skills and geopolitics, sharing his excitement for the industry’s future as it underpins the ongoing development of our digital world.
INTERVIEWS
  NIL and MEMS - a powerful combination
  Revolutionising semiconductor design
  Investment helps accelerate Wooptix’s product development
  Streamlining electronics system development

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LAB NEWS
  Baden-Württemberg attracts imec to lead development of chiplet-based technology
  Collaborative EU Project set to deliver breakthrough in Space Imaging Sensing
  Device enables direct communication among multiple quantum processors
  Imec and ZEISS intensify collaboration
  Imec honours Apple’s Johny Srouji with the 2025 Innovation Award

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VIDEO
FAMES Pilot Line launches Open-Access Call for chip industry

Dominique Noguet, FAMES Pilot Line Project Coordinator, CEA-Leti AND Susana Bonnetier, FAMES Pilot Line Open Access Chairperson, CEA-Leti, provide an update on the FAMES Pilot Line, with the launch of its first Open-Access Call at a dedicated workshop in Brussels, where many potential users participated to learn more about how to submit a User Request to access the pilot line’s cutting-edge microelectronics R&D technologies and services. Users of the pilot line will have access to: two types of PDKs (Pathfinding PDKs for FD-SOI advanced-node performance evaluation and PDKs giving access to silicon, via multi-project wafers (MPW)), specific process steps, modules, integration flows, and demonstrator results, and education and training on FAMES technologies.

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Silicon Semiconductor China
Volume 2025 - Issue 12/01
Providing in-depth analysis and timely reports on the global industry for its 10,000 professional readers in China
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