View this message online
Newsletter: 9th April 2025

 
Interviews Magazine Archive Lab+Fab Contact Us Subscribe

FEATURED
Tokyo Electron and IBM renew collaboration

New five-year agreement will focus on semiconductor and chiplet innovation for the age of generative AI.


Read Article
INDUSTRY NEWS
  Quantum sensors: from lab to chip through semiconductor fabs
  £9 million funding boost to bring key semiconductor manufacturing capability to Scotland
  PCIM Asia Shanghai 2025: Bringing together the Asian power electronics community
  FAMES Pilot Line launches open-access call for chip industry
  Strengthening Europe‘s semiconductor future

View All Industry News
COMPANY NEWS
  Innatera appoints Intralink to bring brain-inspired AI to Asia
  ABLIC strengthens semiconductor portfolio
  Infineon bolsters global lead in automotive semiconductors
  Infineon to acquire Marvell’s Automotive Ethernet business
  Ansys semiconductor solutions certified by TSMC

View All Company News

Europe’s semiconductor industry focuses on sustainable growth
Laith Altimime, President of SEMI Europe, discusses the challenges and opportunities facing the European semiconductor industry. Laith talks sustainability, collaboration, technology innovation, skills and geopolitics, sharing his excitement for the industry’s future as it underpins the ongoing development of our digital world.
INTERVIEWS
  FAMES Pilot Line launches Open-Access Call for chip industry
  NIL and MEMS - a powerful combination
  Revolutionising semiconductor design
  Investment helps accelerate Wooptix’s product development

View All Interviews
LAB NEWS
  Imec pioneers photonic code-division multiplexing FMCW 144GHz distributed radar
  Baden-Württemberg attracts imec to lead development of chiplet-based technology
  Collaborative EU Project set to deliver breakthrough in Space Imaging Sensing
  Device enables direct communication among multiple quantum processors
  Imec and ZEISS intensify collaboration

View All Lab News
VIDEO
Terecircuits shares material science innovations for advanced packaging applications

Wayne Rickard, Terecircuits CEO, outlines the company’s decision to join the US’s National Semiconductor Technology Center, contributing its considerable expertise in the synthesis, characterization and delivery of polymers, encapsulants and thin film coatings for advanced packaging. Wayne explains that, in working alongside industry leaders across the U.S. semiconductor ecosystem, Terecircuits can accelerate the development of advanced material solutions for heterogeneous integration and, in so doing, is helping to tackle critical challenges in high-density, high-performance chip manufacturing.

Watch Video
NEWSLETTER SPONSOR: Edwards



Put yourself back in control with an Edwards intelligent service plan

Care is our spare parts plan. It delivers the parts required for maintenance, usually for one year of operation. Customers benefit from continuity of parts availability and the reliability of using genuine OEM parts. This plan is ideal for customers who service Edwards equipment using in-house personnel.

A service plan allows you to spend less time planning resources - all with the peace of mind that standard maintenance is covered. All our service plans are subscription-based to help you budget and spread your service costs throughout the year. Each service plan can be tailored to your facilities size, operating model, and production processes supported by our machines, allowing you to focus on your productivity goals.



Discover More
Silicon Semiconductor China
Volume 2025 - Issue 12/01
Providing in-depth analysis and timely reports on the global industry for its 10,000 professional readers in China
Silicon Semiconductor MAGAZINE
CORPORATE PARTNERS


Why not join our Corporate Partners?

Your logo will appear on every page of the Silicon Semiconductor Magazine website, every edition of the weekly email newsletter and all 5 editions of our magazine. Join today and receive fantastic visibility to the Silicon Semiconductor Industry.

Shehzad Munshi
Sales Manager (Magazines)
shehzad.munshi@angelbc.com
  Phil Alsop
Editor
phil.alsop@angelbc.com
 
Jackie Cannon
Director of Publishing
jackie.cannon@angelbc.com
 
Silicon Semiconductor magazine delivers keen insight into new and evolving technologies, and how they shape tomorrow's futures, and fortunes.
We hope that you found this newsletter of interest. If not, you may easily unsubscribe or manage your preferences here.

[COMPANY_ADDRESS]