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Newsletter: 29th April 2025

 
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FEATURED
xMEMS extends µCooling Fan-on-a-Chip technology to AI data centres

xMEMS Labs has expanded its µCooling fan-on-a-chip platform into AI data centers, bringing the industry’s first in-module active thermal management solution to high-performance optical transceivers.


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INDUSTRY NEWS
  Microchips: EU off the pace in a global race
  Microchips: EU off the pace in a global race
  Trump’s semiconductor tariffs threaten to affect US medical device industry growth
  2025 IEEE ECTC highlights microelectronics packaging and component breakthroughs
  The Northeast Microelectronics Coalition awards $1.43 million to 19 semiconductor companies

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COMPANY NEWS
  Laser annealing platform the logic choice
  Hiden Analytical launches EP-Replayer
  Critical Manufacturing and Twinzo partner
  Infineon at PCIM Europe 2025
  Renesas debuts new Group in popular RA0 Series

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Europe’s semiconductor industry focuses on sustainable growth
Laith Altimime, President of SEMI Europe, discusses the challenges and opportunities facing the European semiconductor industry. Laith talks sustainability, collaboration, technology innovation, skills and geopolitics, sharing his excitement for the industry’s future as it underpins the ongoing development of our digital world.
INTERVIEWS
  Realising the promise of PICs
  Partnership drives supplier resilience and agility
  CHIPDIPLO project seeks to strengthen European semiconductor industry
  Crescendo increases power density possibilities

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LAB NEWS
  Imec coordinates EU Chips Design Platform
  Smart and compact sensors with Edge-AI
  Imec pioneers photonic code-division multiplexing FMCW 144GHz distributed radar
  Baden-Württemberg attracts imec to lead development of chiplet-based technology
  Collaborative EU Project set to deliver breakthrough in Space Imaging Sensing

View All Lab News
VIDEO
Wafer handling solutions evolve for new materials and applications

Stefan Detterbeck, Director of Sales & Marketing, mechatronic systemtechnik, discusses the company’s recent attendance at SEMICON China, going on to explain the increasing importance of ultra-thin and fragile wafer handling solutions, especially for power electronics and compound semiconductors.

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Silicon Semiconductor China
Volume 2025 - Issue 12/01
Providing in-depth analysis and timely reports on the global industry for its 10,000 professional readers in China
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