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Newsletter: 8th May 2025

 
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German government issues final funding approval for new Infineon's Dresden fab

Infineon to invest over five billion euros in high technology semiconductors at its Dresden site.


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INDUSTRY NEWS
  European-first semiconductor facility launches in Southampton
  Titans of the global semiconductor industry to speak at CEO Summit
  Northeast Microelectronics Coalition Hub launches $10m SCALE Capital Program
  Microchips: EU off the pace in a global race
  Trump’s semiconductor tariffs threaten to affect US medical device industry growth

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COMPANY NEWS
  Cadence unveils Millennium M2000 Supercomputer
  Veeco announces $35 million in advanced packaging lithography system orders
  Building the fabric of quantum networking
  MESI 4.0 Summit 2025 brings manufacturing experts to Porto
  Xanadu reveals quantum computing collaboration with Applied Materials

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Innovative approaches to scaling network-on-chip architectures
The evolution of cloud computing has sparked a pressing need for advanced solutions that maximize computational efficiency while minimizing physical and energy constraints. Modern data centers depend heavily on multi-core processors, often packing over 100 cores into a single chip. By Moritz Brunion, Researcher Design-Technology Co-optimization and James Myers, Program Director System Technology Co-optimization, both at imec.
INTERVIEWS
  Imec coordinates EU Chips Design Platform
  FTD solutions partners with CEA-Leti to improve water infrastructure management
  Realising the promise of PICs
  Wafer handling solutions evolve for new materials and applications

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LAB NEWS
  Eyeo, a new imec spin-off, raises €15 million seed round to give cameras perfect eyesight
  Imec coordinates EU Chips Design Platform
  Smart and compact sensors with Edge-AI
  Imec pioneers photonic code-division multiplexing FMCW 144GHz distributed radar
  Baden-Württemberg attracts imec to lead development of chiplet-based technology

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VIDEO
Delivering a breakthrough in space imaging sensing

Frederic Devriere, Business Marketing Manager, Teledyne e2v, explains how a consortium funded by the European Union (EU) is developing advanced high-resolution image sensing technology that could be used in a variety of space missions, including Earth observation, planetary exploration, and scientific research. The three-year Technology for European iNdependence in Space Image Sensor (TENSIS) project will address the EU-based development of advanced CMOS imaging sensors. The project will aim to create a strategic, competitive advantage for European prime and equipment manufacturers and reduce the dependence on critical technologies and capabilities from outside the EU.

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