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Newsletter:
13th June 2025
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Ensuring gas purity for complex semiconductor manufacturing
As demand for chips grows, the semiconductor
industry is pushing the limits of current manufacturing capabilities.
Companies that invest in cutting-edge QA/QC tools will not only keep
pace with demand, but also gain a competitive advantage in a fiercely
competitive global market. By Daniel Merriman, semiconductor consultant at Thermo Fisher Scientific
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VIDEO INTERVIEW
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Precision motion control - making a difference
Richard Teo, Aerotech's Director of Asia Pacific, explains how precision motion control is so critical for the semiconductor sector when it comes to applications such as wafer inspection, metrology and advanced packaging and shares details of the company’s motion control innovations which help to address these...
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LATEST ON-DEMAND WEBINAR
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Delivering a Maintenance-Free Feedback Solution with Battery-less Energy Harvesting Encoder
Presenting energy harvesting technology and highlighting Broadcom´s AS20-M42M series absolute encoder: Battery-less multi-turn counter integrated to a magnetic single-turn ASIC. The innovative solution is packed into a miniature 20mm diameter with built-in protocol options: SPI/SSI/BiSS-C/RS485.
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VIDEO
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Precision motion control - making a difference
Richard Teo, Aerotech's Director of Asia Pacific, explains how precision motion control is so critical for the semiconductor sector when it comes to applications such as wafer inspection, metrology and advanced packaging and shares details of the company’s motion control innovations which help to address these...
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NEWSLETTER SPONSOR: ULVAC
Advanced Plasma Resist Strip System
The ENVIRO-1Xa photoresist removal equipment from ULVAC, offers superior performance at an exceptional price. The system can handle multiple wafer sizes, ranging from 100 to 200 mm in diameter. The system utilizes a high efficiency downstream plasma source and can achieve ash rates >10µm/min, with a throughput of 70+wph. This is all achieved on a minimal footprint of 1.57m2. It offers high process flexibility that is required for demanding processes, such as: high-dose implanted resist removal, descum and surface modification, SU-8 and fluorinated resist removal, and MEMS sacrificial-layer removal.
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| Silicon Semiconductor China |
Volume 2025 - Issue 4/5
Providing in-depth analysis and timely reports on the global industry for its 10,000 professional readers in China
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