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Material science innovations for advanced packaging applications
Wayne Rickard, Terecircuits CEO, outlines the company’s decision to join
the US’s National Semiconductor Technology Center, contributing its
considerable expertise in the synthesis, characterization and delivery
of polymers, encapsulants and thin film coatings for advanced packaging.
Wayne explains that, in working alongside industry leaders across the
U.S. semiconductor ecosystem, Terecircuits can accelerate the
development of advanced material solutions for heterogeneous integration
and, in so doing, is helping to tackle critical challenges in
high-density, high-performance chip manufacturing.
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NEWSLETTER SPONSOR: Trymax
When Plasma Matters
Meet our team at: SEMICON West • October 7-9, 2025 • Booth number 661
Trymax is an innovative plasma-based company designing, manufacturing and commercializing state of the art equipment solutions for ashing, descum, surface preparation, light etching as well as UV photoresist curing and charge erase. With a product portfolio ranging from 100mm wafer size to 300mm and a world-wide installed base, Trymax has significant market shares at foundries, IDMs, and Wafer Level packaging houses for end applications in Power Semiconductors, RF, Analog, Automotive, MEMS, LED, and CMOS. Recognized for its reliability, low cost of ownership, and performances, Trymax continuously innovates to support its customer’s needs.
Want to know more? Meet our team at:
• SEMICON West, booth number 661
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