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VIDEO INTERVIEW
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High-power, high-performance semiconductor packaging design expertise
Dr Larry Zu, CEO of Sarcina Technology, a global semiconductor packaging specialist, discusses the launch of the company’s AI platform to enable advanced AI packaging solutions that can be tailored to meet specific customer requirements. Leveraging ASE’s FOCoS-CL (Fan-Out Chip-on-Substrate-Chip Last) assembl...
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LATEST ON-DEMAND WEBINAR
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Delivering a Maintenance-Free Feedback Solution with Battery-less Energy Harvesting Encoder
Presenting energy harvesting technology and highlighting Broadcom´s AS20-M42M series absolute encoder: Battery-less multi-turn counter integrated to a magnetic single-turn ASIC. The innovative solution is packed into a miniature 20mm diameter with built-in protocol options: SPI/SSI/BiSS-C/RS485.
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VIDEO
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High-power, high-performance semiconductor packaging design expertise
Dr Larry Zu, CEO of Sarcina Technology, a global semiconductor packaging specialist, discusses the launch of the company’s AI platform to enable advanced AI packaging solutions that can be tailored to meet specific customer requirements. Leveraging ASE’s FOCoS-CL (Fan-Out Chip-on-Substrate-Chip Last) assembl...
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NEWSLETTER SPONSOR: Trymax
When Plasma Matters
Trymax is an innovative plasma-based company designing, manufacturing and commercializing state of the art equipment solutions for ashing, descum, surface preparation, light etching as well as UV photoresist curing and charge erase. With a product portfolio ranging from 100mm wafer size to 300mm and a world-wide installed base, Trymax has significant market shares at foundries, IDMs, and Wafer Level packaging houses for end applications in Power Semiconductors, RF, Analog, Automotive, MEMS, LED, and CMOS. Recognized for its reliability, low cost of ownership, and performances, Trymax continuously innovates to support its customer’s needs.
Want to know more? Meet our team at:
• SEMICON West, booth number 661
• SEMICON Europa, booth number B1447
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