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Newsletter: 16th October 2025

 
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Bosch, Volkswagen, Nokia and Europe’s Tech Giants unite to secure photonics future in FP10

Bosch, Volkswagen, Nokia, ZEISS, TRUMPF and other industry giants urge the EU to create a €2 billion photonics programme in FP10.


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INDUSTRY NEWS
  IEDM celebrates the 100th anniversary of the Field Effect Transistor (FET). . .
  SEMI reports global 300 mm fab equipment spending expected to total $374B over three years
  Duke of Edinburgh shines a light on silicon photonics
  The Robotaxi race is heating up globally in 2025
  ESIA discusses Europe's semiconductor future

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COMPANY NEWS
  Applied Materials and Arizona State University celebrate Opening of ‘Materials-to-Fab’ Center
  ROHM appoints Dr. Christian Felgemacher as Director Application Engineering
  Renesas expands Industrial Sensing Portfolio
  Advanced Energy introduces 401M Mid-Infrared Pyrometer
  Digital Dynamics unveils Fusion Control Modules at SEMICON West

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Ensuring the reliable and long-lasting operation of cutting-edge semiconductor fabrication with thermoplastic pipe stress analysis
Plastic piping systems are crucial for High Purity Water applications and a highly capable alternative to metal when it comes to transporting chemicals and other fluids. However, their implementation requires a number of key considerations as thermoplastics have unique material properties. Conducting a comprehensive pipe stress analysis helps to prevent issues and increase reliability, safety, and longevity.
INTERVIEWS
  Liquid cooling option STR provides SLT and BI solution for HPC, AI and automotive devices
  High-tech vacuum coating systems come to Phoenix
  Disruptive chipset platform transforms satellite agility, efficiency and sustainability
  Celebrating semiconductor success in Phoenix

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LAB NEWS
  IEDM celebrates the 100th anniversary of the Field Effect Transistor (FET). . .
  ESIA discusses Europe's semiconductor future
  AI system learns from many types of scientific information and runs experiments to discover new materials
  Leadership transition at imec
  French team led by CEA-Leti develops first hybrid memory technology enabling on-chip AI learning and inference

View All Lab News
VIDEO INTERVIEW


Electronics visibility eliminates energy waste at the chip level, and beyond

Noam Brousard, Vice President, Solutions Engineering, proteanTecs, explains how semiconductors are straining under GenAI workloads such as model training, inference, and high-performance AI applications, and are quietly bleeding energy across data centres. proteanTecs has invented ML-driven deep data health & pe...

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LATEST ON-DEMAND WEBINAR


Delivering a Maintenance-Free Feedback Solution with Battery-less Energy Harvesting Encoder

Presenting energy harvesting technology and highlighting Broadcom´s AS20-M42M series absolute encoder: Battery-less multi-turn counter integrated to a magnetic single-turn ASIC. The innovative solution is packed into a miniature 20mm diameter with built-in protocol options: SPI/SSI/BiSS-C/RS485.

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Silicon Semiconductor China
Volume 2025 - Issue 4/5
Providing in-depth analysis and timely reports on the global industry for its 10,000 professional readers in China
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