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Newsletter:
21st October 2025
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VIDEO INTERVIEW
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Electronics visibility eliminates energy waste at the chip level, and beyond
Noam Brousard, Vice President, Solutions Engineering, proteanTecs, explains how semiconductors are straining under GenAI workloads such as model training, inference, and high-performance AI applications, and are quietly bleeding energy across data centres. proteanTecs has invented ML-driven deep data health & pe...
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LATEST ON-DEMAND WEBINAR
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Delivering a Maintenance-Free Feedback Solution with Battery-less Energy Harvesting Encoder
Presenting energy harvesting technology and highlighting Broadcom´s AS20-M42M series absolute encoder: Battery-less multi-turn counter integrated to a magnetic single-turn ASIC. The innovative solution is packed into a miniature 20mm diameter with built-in protocol options: SPI/SSI/BiSS-C/RS485.
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NEWSLETTER SPONSOR: ULVAC
Advanced Semiconductor Solutions for PVD, CVD & Etching
ULVAC offers advanced semiconductor solutions for sputtering, CVD and resist strip/ashing. The Entron-EXX Sputtering System is a single or tandem platform with up to 12 process modules for Pad/RDL, novel channel materials, EUV/multi patterning HM, stress tuning spacers, barrier/seed, advanced logic, DRAM, NAND/NVM and packaging applications. The uGmni 200/300 is a common core platform for PVD, CVD, Ash and Etch in power devices: seed & metal layer sputtering; MEMS sensors: PZT sputtering & etching; Optical devices: VCSEL etching; Packaging: Descum ashing applications. The Enviro™ Optima Resist Strip system delivers 240 WPH throughput with RF downstream plasma with >12 μ/min ash rate for Descum/HDI/polymer residue removal. See ULVAC at SEMICON EUROPA • Hall B1, Booth 1139 • 18-21 November 2025
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| Silicon Semiconductor China |
Volume 2025 - Issue 4/5
Providing in-depth analysis and timely reports on the global industry for its 10,000 professional readers in China
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