|
View this message online
|
|
|
Newsletter:
11th November 2025
|
|
|
|
|
|
|
|
|
|
|
|
How simulation-driven engineering optimises sealing performance for semiconductors
The semiconductor industry operates under extreme
precision requirements where even microscopic failures can result in
significant yield losses and costly downtime. Traditional testing
methods, while reliable, often require months or years to validate
seal performance under real-world conditions. Offered by component
partners like Trelleborg Sealing Solutions, simulation-driven
engineering is an approach that can predict seal behavior years into the
future within hours of computational analysis. By Alan Astbury, Simulation Methods Developer, Trelleborg Sealing Solutions
|
|
|
|
|
|
|
VIDEO INTERVIEW
|
High-power, high-performance semiconductor packaging design expertise
Dr Larry Zu, CEO of Sarcina Technology, a global semiconductor packaging specialist, discusses the launch of the company’s AI platform to enable advanced AI packaging solutions that can be tailored to meet specific customer requirements. Leveraging ASE’s FOCoS-CL (Fan-Out Chip-on-Substrate-Chip Last) assembl...
|
|
|
|
LATEST ON-DEMAND WEBINAR
|
Delivering a Maintenance-Free Feedback Solution with Battery-less Energy Harvesting Encoder
Presenting energy harvesting technology and highlighting Broadcom´s AS20-M42M series absolute encoder: Battery-less multi-turn counter integrated to a magnetic single-turn ASIC. The innovative solution is packed into a miniature 20mm diameter with built-in protocol options: SPI/SSI/BiSS-C/RS485.
|
|
|
NEWSLETTER SPONSOR: ULVAC
Advanced Plasma Resist Strip System
The ENVIRO-1Xa photoresist removal equipment from ULVAC, offers superior performance at an exceptional price. The system can handle multiple wafer sizes, ranging from 100 to 200 mm in diameter. The system utilizes a high efficiency downstream plasma source and can achieve ash rates >10µm/min, with a throughput of 70+wph. This is all achieved on a minimal footprint of 1.57m2. It offers high process flexibility that is required for demanding processes, such as: high-dose implanted resist removal, descum and surface modification, SU-8 and fluorinated resist removal, and MEMS sacrificial-layer removal.
|
 |
| Silicon Semiconductor China |
Volume 2025 - Issue 4/5
Providing in-depth analysis and timely reports on the global industry for its 10,000 professional readers in China
|
|
|
Silicon Semiconductor MAGAZINE
CORPORATE PARTNERS
Why not join our Corporate Partners?
Your logo will appear on every page of the Silicon Semiconductor Magazine website, every edition of the
weekly email newsletter and all 5 editions of our magazine. Join today and receive fantastic visibility
to the Silicon Semiconductor Industry.
|
|
|
|
|
Silicon Semiconductor magazine delivers keen insight into new and evolving technologies, and how they shape tomorrow's futures, and fortunes.
|
|
We hope that you found this newsletter of interest. If not, you may easily
unsubscribe or manage your preferences here.
[COMPANY_ADDRESS]
|
