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Newsletter:
14th November 2025
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Quantum Motion selected by DARPA
Quantum Motion has been selected by the U.S. Defense Advanced Research Projects Agency (DARPA) to advance to Stage B of the Quantum Benchmarking Initiative (QBI).
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How simulation-driven engineering optimises sealing performance for semiconductors
The semiconductor industry operates under extreme
precision requirements where even microscopic failures can result in
significant yield losses and costly downtime. Traditional testing
methods, while reliable, often require months or years to validate
seal performance under real-world conditions. Offered by component
partners like Trelleborg Sealing Solutions, simulation-driven
engineering is an approach that can predict seal behavior years into the
future within hours of computational analysis. By Alan Astbury, Simulation Methods Developer, Trelleborg Sealing Solutions
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VIDEO INTERVIEW
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Electronics visibility eliminates energy waste at the chip level, and beyond
Noam Brousard, Vice President, Solutions Engineering, proteanTecs, explains how semiconductors are straining under GenAI workloads such as model training, inference, and high-performance AI applications, and are quietly bleeding energy across data centres. proteanTecs has invented ML-driven deep data health & pe...
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LATEST ON-DEMAND WEBINAR
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Delivering a Maintenance-Free Feedback Solution with Battery-less Energy Harvesting Encoder
Presenting energy harvesting technology and highlighting Broadcom´s AS20-M42M series absolute encoder: Battery-less multi-turn counter integrated to a magnetic single-turn ASIC. The innovative solution is packed into a miniature 20mm diameter with built-in protocol options: SPI/SSI/BiSS-C/RS485.
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NEWSLETTER SPONSOR: ULVAC
Advanced Semiconductor Solutions for PVD, CVD & Etching
ULVAC offers advanced semiconductor solutions for sputtering, CVD and resist strip/ashing. The Entron-EXX Sputtering System is a single or tandem platform with up to 12 process modules for Pad/RDL, novel channel materials, EUV/multi patterning HM, stress tuning spacers, barrier/seed, advanced logic, DRAM, NAND/NVM and packaging applications. The uGmni 200/300 is a common core platform for PVD, CVD, Ash and Etch in power devices: seed & metal layer sputtering; MEMS sensors: PZT sputtering & etching; Optical devices: VCSEL etching; Packaging: Descum ashing applications. The Enviro™ Optima Resist Strip system delivers 240 WPH throughput with RF downstream plasma with >12 μ/min ash rate for Descum/HDI/polymer residue removal. See ULVAC at SEMICON EUROPA • Hall B1, Booth 139 • 18-21 November 2025
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| Silicon Semiconductor China |
Volume 2025 - Issue 4/5
Providing in-depth analysis and timely reports on the global industry for its 10,000 professional readers in China
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