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Newsletter:
27th November 2025
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How simulation-driven engineering optimises sealing performance for semiconductors
The semiconductor industry operates under extreme
precision requirements where even microscopic failures can result in
significant yield losses and costly downtime. Traditional testing
methods, while reliable, often require months or years to validate
seal performance under real-world conditions. Offered by component
partners like Trelleborg Sealing Solutions, simulation-driven
engineering is an approach that can predict seal behavior years into the
future within hours of computational analysis. By Alan Astbury, Simulation Methods Developer, Trelleborg Sealing Solutions
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VIDEO INTERVIEW
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Advanced microscopy innovation meets the demands of AI and 3D packaging
Dr Thomas Rodgers, senior director and head of electronics marketing at ZEISS Microscopy, discusses the forthcoming International Symposium for Testing and Analysis, or ISTFA, taking place in Pasadena, California, November 16-20th. He outlines the company’s presence at the event, where the focus is on heteroge...
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LATEST ON-DEMAND WEBINAR
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Delivering a Maintenance-Free Feedback Solution with Battery-less Energy Harvesting Encoder
Presenting energy harvesting technology and highlighting Broadcom´s AS20-M42M series absolute encoder: Battery-less multi-turn counter integrated to a magnetic single-turn ASIC. The innovative solution is packed into a miniature 20mm diameter with built-in protocol options: SPI/SSI/BiSS-C/RS485.
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NEWSLETTER SPONSOR: Bosch
Unlock silicon carbide insights
Bosch is one of the leading semiconductor companies for the automotive industry. With over two decades of experience in silicon carbide (SiC) development, Bosch offers a comprehensive portfolio of SiC semiconductors – from bare dies to discretes and power modules. The new white paper “Insights into Bosch’s SiC semiconductor technology” provides a detailed overview of Bosch’s SiC technology and its potential for next-generation mobility. Key topics include: - Dual-channel SiC trench MOSFET technology
- Advanced SiC substrates
- Transition to 200 mm wafers
- Bosch’s global manufacturing network
- Strategic roadmap and scaling approach
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| Silicon Semiconductor China |
Volume 2025 - Issue 4/5
Providing in-depth analysis and timely reports on the global industry for its 10,000 professional readers in China
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