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Newsletter:
12th February 2026
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VIDEO INTERVIEW
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Cloudberry launches Europe’s first semiconductor venture fund
Rene Kromhof, Founding Partner, Cloudberry, a venture capital firm based in Helsinki and London, explains the background to the company’s launch of Europe’s first semiconductor venture fund with an initial close of €30 million. The fund invests in companies advancing the technological frontier with semicon...
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LATEST ON-DEMAND WEBINAR
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Delivering a Maintenance-Free Feedback Solution with Battery-less Energy Harvesting Encoder
Presenting energy harvesting technology and highlighting Broadcom´s AS20-M42M series absolute encoder: Battery-less multi-turn counter integrated to a magnetic single-turn ASIC. The innovative solution is packed into a miniature 20mm diameter with built-in protocol options: SPI/SSI/BiSS-C/RS485.
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NEWSLETTER SPONSOR: ULVAC
Advanced Semiconductor Solutions for PVD, CVD & Etching
ULVAC offers advanced semiconductor solutions for sputtering, CVD and resist strip/ashing. The Entron-EXX Sputtering System is a single or tandem platform with up to 12 process modules for Pad/RDL, novel channel materials, EUV/multi patterning HM, stress tuning spacers, barrier/seed, advanced logic, DRAM, NAND/NVM and packaging applications. The uGmni 200/300 is a common core platform for PVD, CVD, Ash and Etch in power devices: seed & metal layer sputtering; MEMS sensors: PZT sputtering & etching; Optical devices: VCSEL etching; Packaging: Descum ashing applications. The Enviro™ Optima Resist Strip system delivers 240 WPH throughput with RF downstream plasma with >12 μ/min ash rate for Descum/HDI/polymer residue removal.
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| Silicon Semiconductor China |
Volume 2025 - Issue 10/11
Providing in-depth analysis and timely reports on the global industry for its 10,000 professional readers in China
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