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Newsletter: 9th April 2026

 
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FEATURED
CEA-Leti, CEA-List and PSMC collaborate


CEA-Leti and CEA-List, a specialist in smart digital systems, have announced a strategic collaboration with Powerchip Semiconductor Manufacturing Corporation (PSMC).

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INDUSTRY NEWS
  UK Semiconductor Centre appoints two new Directors to its leadership team
  Digital Twin Semiconductor Supply Chain market to reach $7.9 billion by 2033
  Metallic Oxide Semiconductor Field Effect Transistor market to surpass $15.5 billion by 2033
  Microelectronics US 2026 showcases practical solutions
  Semiconductor Chip Test Handler market to hit USD 2.97 billion by 2033

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COMPANY NEWS
  Q.ANT appoints Michael Krueger as Vice President Commercials
  OMRON appoints Virendra Shelar as President and CEO of its Industrial Automation Business in EMEA
  NVIDIA AI Ecosystem expands
  Hamamatsu Photonics and RIKEN sign framework agreement on collaboration
  Plansee Group increases stake in Molymet

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Preventing liquid cross-contamination in semiconductor manufacturing
Producing high-purity wafers via the CMP process is a critical application and the halting of harmful slurry-DIW cross-contamination and back-flow can be optimised with the Malema Interconnect Interlock Device. By Jay Rajagopalan, Malema
INTERVIEWS
  Streamlining the concept to production journey as advanced packaging gains momentum
  Industrialising 300 mm silicon photonics for bandwidth-hungry AI interconnects
  EU-India trade deal spells semiconductor success
  10x Smaller, 2x Faster: The Breakthrough Behind MTR™ EUV Resist

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LAB NEWS
  Hamamatsu Photonics and RIKEN sign framework agreement on collaboration
  Imec names NVIDIA’s Jensen Huang as recipient of the 2026 imec Lifetime of Innovation Award
  CEA-Leti and Fraunhofer IPMS validate wafer exchange for ferroelectric memory materials
  Imec receives 'the world’s most advanced' High NA EUV system
  University of Sheffield to lead £12.5m national centre for next-generation semiconductor systems

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VIDEO INTERVIEW


Quantum data centres set to complement classical computing

Matthew Martin, Managing Director of Quantum Design Oxford, discusses the critical role that quantum data centres will play in advancing the deployment of quantum technologies. He explains how quantum data centres will enable hybrid quantum–classical computing, cloud-based access to quantum hardware, and speci...

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LATEST ON-DEMAND WEBINAR


Delivering a Maintenance-Free Feedback Solution with Battery-less Energy Harvesting Encoder

Presenting energy harvesting technology and highlighting Broadcom´s AS20-M42M series absolute encoder: Battery-less multi-turn counter integrated to a magnetic single-turn ASIC. The innovative solution is packed into a miniature 20mm diameter with built-in protocol options: SPI/SSI/BiSS-C/RS485.

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NEWSLETTER SPONSOR: EV Group (EVG)



Supporting the most advanced applications in micro- and nanotechnology

EV Group (EVG) provides innovative process solutions and expertise for implementing cutting-edge semiconductor designs and 3D integration of microchips. The company’s mission and vision - to be first in new technologies and to support the most advanced applications in micro- and nanotechnology - enable customers to successfully market their new product ideas. EVG’s products, designed for high-volume production, include wafer bonding, lithography, thin-wafer processing, and metrology systems. These solutions drive further advancements in semiconductor frontend scaling, 3D integration, advanced packaging, and other electronics and photonics applications.



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