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Newsletter: 30th April 2026

 
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Rising memory costs already affecting most IT buyers

Vespertec research reveals widespread impact on infrastructure planning, with organisations extending hardware lifecycles and delaying projects as constraints persist.


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INDUSTRY NEWS
  Northeast Microelectronics Coalition awards $1m to eight startups
  Global semiconductor equipment billings reached $135 billion in 2025
  Reshore semiconductor manufacturing to UK and US to meet sustainability goals
  AI compute boom propels Foundry 2.0 market to $360 billion
  Gartner forecasts worldwide semiconductor revenue to exceed $1.3 trillion in 2026

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COMPANY NEWS
  Applied Materials introduces deposition systems for Angstrom-era logic chips
  Marvell acquires Polariton Technologies
  Antaira Technologies achieves SEMI E187 certification for semiconductor cybersecurity
  OMRON and Dassault Systèmes partner
  Advantest forms strategic partnership with Applied Materials and joins EPIC Platform

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Liquid cooling option STR provides SLT and BI solution for HPC, AI and automotive devices
Davette Berry, sr. director of business development for Advantest, discusses the expansion of the company’s 7038 System-Level Test Platform, with right-sized single test rack solution for high volume manufacturing. The new liquid-cooling enabled system delivers affordable, high-density SLT and burn-in test for high-demand, lower-volume HPC, AI, and automotive devices. Davette also looks forward to Advantest’s presence at SEMICON West and also shares some insights as to what will be keeping the company busy over the coming months
INTERVIEWS
  AAF International teams with Airtho and UNH on innovative clean room project
  Spain’s semiconductor sector delivers technology innovation for the digital economy
  Advanced packaging the latest opportunity for technology design and development expert
  PIC100 platform enters high volume production

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LAB NEWS
  New chip can protect wireless biomedical devices from quantum attacks
  CEA-Leti and Fraunhofer IPMS validate wafer exchange for ferroelectric memory materials
  CEA-Leti, CEA-List and PSMC collaborate
  Hamamatsu Photonics and RIKEN sign framework agreement on collaboration
  Imec names NVIDIA’s Jensen Huang as recipient of the 2026 imec Lifetime of Innovation Award

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VIDEO INTERVIEW


Building America's first dedicated semiconductor subfab R&D facility

Scott Balaguer, CEO of ISRL USA, explains why International SubFAB Research Labs (ISRL USA) and AI Infrastructure Partners (AIIP) have signed a memorandum of understanding (MOU) to design, build, and operate the United States’ first purpose-built research and development facility dedicated to semiconductor sub...

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NEWSLETTER SPONSOR: AES Semi Gas



The Foundation of Success for Semiconductors

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