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Cloudberry VC launches Europe’s first semiconductor venture fund
Rene Kromhof, Founding Partner, Cloudberry VC, a venture
capital firm based in Helsinki and London, explains the background to the
company’s launch of Europe’s first semiconductor venture fund with an initial
close of €30 million. The fund invests in companies advancing the technological
frontier with semiconductors, photonics and advanced materials to advance
compute, connectivity, sensing and power.
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VIDEO INTERVIEW
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US expansion built on wet process systems success
Dragan Cekic, Vice President Business Development, AP&S US Inc, provides an update on the company’s presence in the US semiconductor market, with contract wins, silicon carbide, process validation and operator training all covered. Dragan also discusses AP&S’s Productronica Innovation Award successes – wit...
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LATEST ON-DEMAND WEBINAR
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Delivering a Maintenance-Free Feedback Solution with Battery-less Energy Harvesting Encoder
Presenting energy harvesting technology and highlighting Broadcom´s AS20-M42M series absolute encoder: Battery-less multi-turn counter integrated to a magnetic single-turn ASIC. The innovative solution is packed into a miniature 20mm diameter with built-in protocol options: SPI/SSI/BiSS-C/RS485.
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NEWSLETTER SPONSOR: SEMI 3D and Systems Summit 2026
SEMI 3D and Systems Summit 2026
The SEMI 3D and Systems Summit 2026 takes place in Dresden, Germany from June 17 to 19, bringing together semiconductor and packaging leaders to explore the strategies and technologies driving next-generation heterogeneous systems integration. Expert-led sessions cover chiplet architectures, hybrid bonding, co-packaged optics, AI-driven system architectures, and AR/VR and wearable intelligence, with a strong focus on Europe's role in advancing design leadership, materials innovation, and the transition from lab to fab.
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| Silicon Semiconductor China |
Volume 2026 - Issue Feb/Mar
Providing in-depth analysis and timely reports on the global industry for its 10,000 professional readers in China
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