The SEMI 3D and Systems Summit 2026 takes place in Dresden, Germany from June 17 to 19, bringing together semiconductor and packaging leaders to explore the strategies and technologies driving next-generation heterogeneous systems integration. Expert-led sessions cover chiplet architectures, hybrid bonding, co-packaged optics, AI-driven system architectures, and AR/VR and wearable intelligence, with a strong focus on Europe's role in advancing design leadership, materials innovation, and the transition from lab to fab.