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| Newsletter date: Wednesday 23rd October 2019 | |||||
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imec and KU Leuven spin-off, closes first-round funding
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Imec monolithic thin-film image sensor
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TE Connectivity signs agreement to acquire Silicon Microstructures
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Don't miss the AP&S wet process technology highlights at this year's Semicon Europa 2019.
At our booth B1716 in hall B1, exciting innovations awaits you: Our eless plating wet bench Vulcanio for advanced UBM, AI based predictive maintenance solutions all around your wet process machinery as well as some thrilling up-dates regarding our expanded in-house laboratory 'Demo Center'. Visit www.ap-s.de right now. | |||||
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Melexis introduces unique relative pressure sensor IC
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Integra Devices is now Xidas
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Mycronic receives order for two Prexision Lite 8 Evo mask writers
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Regulation should not get in the way of smart electronic skin patches
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FormFactor Acquires FRT GMBH
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