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| Newsletter date: Friday 13th November 2020 |
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3D-Micromac Unveils high-Throughput Selective Laser Annealing System For Magnetic Sensor Manufacturing
Micromac AG, in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, medical device and electronics markets, tod...
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Advanced process solutions for industry leaders
RENA Technologies North America (RENA NA), experts in Wet Processing of Compound Semi Materials, provides our customers in high technology Advanced Process Solutions.
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IQE develops path for VCSEL growth on silicon
Germanium-based IQGeVCSEL 150 technology provides step to 200 mm and 300 mm VCSEL growth on silicon substrates
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Deca Announces Chiplet Advanced Packaging Partnership with ADTEC
Deca,
a provider of advanced electronic interconnect technologies,
announced the signing of an agreement with ADTEC Engineering to join its
new...
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Dialog Semiconductor Licenses its Non-Volatile Resistive RAM Technology to GLOBALFOUNDRIES
View of Dialog's Resistive Memory Architecture. Data stored as a robust conductive bridge vs. charges on a traditional floating gate
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EV GROUP addresses key process gap in heterogeneous integration
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology, and semiconductor markets, has announced that it...
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Picosun’s success brings Chairman of the Board National Entrepreneur Award of Finland 2020
Mr. Kustaa Poutiainen, The Chairman of the Board and founder of Picosun Group
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ACM Research Highlights WLP Processing Equipment for OSAT Customers
ACM Research, a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, as highlighted the a...
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