SiS Magazine
Newsletter date: Monday 23rd November 2020
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News Image Picosun’s medical ALD solutions enable safer surgeries

Picosun Group, the supplier of AGILE ALD (Atomic Layer Deposition) thin film coating solutions, partners with prominent Chinese hospitals and research...

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News Image ACM Research Enters 3D TSV Copper Plating Market

ACM Research, a supplier of wafer processing solutions for semiconductor and advanced wafer-level packaging (WLP) applications, today introduced its U...

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Get involved. The 2019 event is just around the corner.

‘HYDROGEN GENERATION from water is at the heart of manufacturing industry’s decarbonised future, and the world’s. Right now, Cummins is advancing the next generation of alkaline and PEM technologies and delivering some of the world’s safest, most compact and cost-efficient onsite systems for industries worldwide. If you’re ready for #GENERATIONH, so are we.’
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News Image Park Systems Announces NanoScientific Symposium Asia - November 24-25 2020

Park Systems and NanoScientific Publications announce NanoScientific Symposium Asia, which will be held virtually on Nov. 24-25, 2020. The event is fo...

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News Image Silicon Wafer Shipments Slip in Third Quarter 2020 but Strong for Year

Worldwide silicon wafer area shipments contracted 0.5% to 3,135 million square inches in the third quarter of 2020 compared to the second quarter of...

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News Image 3D-Micromac Unveils high-Throughput Selective Laser Annealing System For Magnetic Sensor Manufacturing

Micromac AG, in laser micromachining and roll-to-roll laser systems for the semiconductor, photovoltaic, medical device and electronics markets, tod...

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Adverter Media Pack
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News Image Advanced process solutions for industry leaders

RENA Technologies North America (RENA NA), experts in Wet Processing of Compound Semi Materials, provides our customers in high technology Advanced Process Solutions.

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News Image IQE develops path for VCSEL growth on silicon

Germanium-based IQGeVCSEL 150 technology provides step to 200 mm and 300 mm VCSEL growth on silicon substrates

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News Image Deca Announces Chiplet Advanced Packaging Partnership with ADTEC

Deca, a provider of advanced electronic interconnect technologies, announced the signing of an agreement with ADTEC Engineering to join its new...

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SiS Magazine
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