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Newsletter: 4th July 2023
FEATURED
Imec and ASML sign MoU

ASML is making a substantial commitment in imec's future state-of-the-art pilot line.


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INDUSTRY NEWS
  Silicon Photonics market Size worth over $55 billion by 2035
  Advancing workforce development collaborations
  Lockheed Martin And GlobalFoundries collaborate
  Asia takes center stage

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COMPANY NEWS
  Siemens extends support for Samsung
  Micron to build semiconductor facility in India
  Samsung Electronics unveils Foundry Vision
  PulseForge and NADAtech join forces

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How advanced cleaning helps achieve optimal wafer yields at advanced semiconductor nodes
With the introduction of SAPS and TEBO technology in a megasonic system, semiconductor manufacturers now have new tools in their fight to achieve optimal wafer yields. By ACM Research.
INTERVIEWS
  The potential of AI
  Current scenario of the semiconductor wafer industry
  Playing politics: The semiconductor supply chain
  A hybrid approach optimises semiconductor process development

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LAB NEWS
  Advancing Silicon Spin Qubit Research for Quantum Computing
  Making the most of microscanners
  Increasing yield in chip production
  Extending Moore’s Law

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VIDEO
AngelTech Rewind 2023

It’s of no surprise that advances associated with the high-volume manufacture of wide bandgap power devices took centre-stage at CS International 2023. With sluggish handset sales providing a headwind to the GaAs microelectronic market and the production of commercial displays based on microLEDs still to really commence, there is good reason why much of the coverage of this two-day meeting, held at the Sheraton Hotel at Brussels Airport on 18-19 April, centred around ramping and improving the production of GaN and SiC power devices and modules.

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NEWSLETTER SPONSOR: EV Group



EV Group

EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices. A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and inspection/metrology systems.

With state-of-the-art application labs and cleanrooms at its headquarters in Austria, as well as in North America and Asia.

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Silicon Semiconductor China
Volume 2023 - Issue 4/5
Providing in-depth analysis and timely reports on the global industry for its 10,000 professional readers in China
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AngelTech 2024     16th - 17th April 2024     Brussels, Belgium

Comprising of CS International (celebrating its 13th anniversary), PIC International (now in its 8th year), and Power Electronics (PE) International (now in its 2nd year).

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