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Industry News

News

Thursday 1st October 2026

Paragraf expands 2D materials portfolio

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Wednesday 30th September 2026

Advanced packaging takes centre stage as AI reshapes the semiconductor value chain

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Tuesday 29th September 2026

Nearly six in ten CXOs are excited by the opportunity of radical innovation as a growth strategy

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Thursday 17th September 2026

TCS launches next-gen system-on-chip design services for automotive and semiconductor companies

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Wednesday 16th September 2026

Data centre IT semiconductor and component revenue surges 182%

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Monday 14th September 2026

Semiconductor packaging underfill market to reach $3.4 billion by 2033

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Friday 11th September 2026

Olivier Janin appointed new ESIA Director General

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Thursday 10th September 2026

TSMC and ASML pioneer large-format photomasks for High-NA EUV

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Thursday 10th September 2026

TSMC and ASML announce initiative to pioneer industry transition to large-format photomasks for high NA EUV

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Thursday 3rd September 2026

Everspin and Teledyne HiRel partner to advance MRAM for Aerospace and Defense

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Sunday 30th August 2026

7.2% CAGR signals the next wave of AI, EV and Advanced Computing growth

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Sunday 30th August 2026

EV-Specific semiconductor chips market to reach $57.48 billion by 2034

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Wednesday 26th August 2026

Agentrys raises $24.5 million to build agentic design automation for chipmakers

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Sunday 16th August 2026

Semiconductor inspection equipment set for 7.9% CAGR growth through 2034

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Wednesday 12th August 2026

Strong momentum in chip sales continues into Q2 2026

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Wednesday 12th August 2026

IMAPS enhances IMAPS Academy

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Tuesday 11th August 2026

Everspin Technologies and MaxLinear collaborate to advance memory efficiency

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Monday 10th August 2026

AI infrastructure boom shifts from chip race to supply-chain race, says GlobalData

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Wednesday 22nd July 2026

The applications driving materials informatics

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Wednesday 22nd July 2026

Semiconductor metrology and inspection market to reach $15.8 billion by 2034

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Monday 13th July 2026

Infineon opens Dresden fab

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Monday 13th July 2026

AI reshapes back-end equipment

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Monday 13th July 2026

Intel to invest €5 billion to expand European manufacturing output

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Tuesday 7th July 2026

Fraunhofer advances CMOS-compatible infrared sensor technology