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Weekly Newsletter
14th July 2022
Silicon Semiconductor magazine delivers keen insight into new and evolving technologies, and how they shape tomorrow's futures, and fortunes.
Top News
Quantinuum Expands Collaboration with JSR

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Top News
ACM Research Introduces New Post-CMP Cleaning Tool

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This article was originally featured in Volume 2022
Issue 3 of Silicon Semiconductor Magazine.
MAGAZINE FEATURE
 
Samsung progresses developing silicon photonics for LiDAR

Microelectronics has revolutionized almost every aspect of life. Efforts to incorporate Silicon photonic integrated circuits (PICs) into advanced CMOS ICs often center on requirements that II-VI or III-V technologies cannot solely address. Computing, automotive, wellness and myriad other applications will or are already benefitting from integrated photonic devices that leverage various silicon or hybrid technologies. LiDAR is at an inflection point where further advances to reduce size and increase performance will hinge on new approaches like those envisioned by researchers at Samsung’s Advanced Institute of Technology who report on SiP advances on the road to better LiDAR PICs.

BY DONGJAE SHIN, KYOUNGHO HA, AND HYUCK CHOO, SAMSUNG ADVANCED INSTITUTE OF TECHNOLOGY




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Pandemic lessons learned will shape IC manufacturing well beyond 2022

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Imec Overcomes Fundamental Operation Challenge for Voltage Controlled RAM

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VIDEO

Edwards Vacuum Interview
Mark Andrews, Editor of Silicon Semiconductor speaks to Paul Neller, VP of Semiconductor Division Marketing at Edwards Vacuum about the path to Fab sustainability that can increase profits while fighting climate change.

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ADDITIONAL NEWS

Pfeiffer Vacuum Introduces New Multi-Stage Roots Pumps ACP 90
Pfeiffer Vacuum, one of the world’s leading suppliers of vacuum technology, introduces new multi-stage Roots pumps ACP 90, which...

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Lam Research, Entegris, Gelest Team Up to Advance EUV Dry Resist Technology
Lam Research, Entegris, and Gelest, Inc, a Mitsubishi Chemical Group company, have an...

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ClassOne Technology Announces New Surface Preparation Technologies
ClassOne Technology, a global provider of advanced electroplating and wet processing tools for microelectronics manufacturing, has...

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Particle Measuring Systems announces the Ultra DI 20 Plus
The Ultra DI 20 Plus builds off the industry-leading sensitivity and reliability of the known and trusted Ultra DI line of instru...

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EV Group achieves die to wafer fusion and hybrid bonding milestone
EV Group (EVG), a supplier of wafer bonding and lithography equipment for the MEMS, nanotechnology and semiconductor markets, toda...

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NXP Helps Standardize Next-Generation Security
NXP Semiconductors has announced that a specialized security algorithm co-authored by NXP security experts has been selected by NI...

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Global Semiconductor Sales Increase 18.0% Year-to-Year
The Semiconductor Industry Association (SIA) has announced global semiconductor industry sales were $51.8 billion in the month of ...

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Applied Materials Acquires Picosun
Applied Materials has announced it has acquired Picosun Oy, a privately held semiconductor equipment company based in Espoo, Fin...

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Silicon ISSUE 3
Volume 2022
Silicon Semiconductor Magazine
Featuring: Avoid hydrogen shortages with on-site generation; Electroplating innovation enables ultrafine indium bonding; New micro-textured film enables universal bare die carriers; Plus more...
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