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Weekly Newsletter
14th July 2022
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Silicon Semiconductor magazine delivers keen insight into new and evolving technologies, and how they shape tomorrow's futures, and fortunes.
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This article was originally featured in Volume 2022
Issue 3 of Silicon Semiconductor Magazine.
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Samsung progresses developing silicon photonics for LiDAR
Microelectronics has revolutionized almost every aspect of life. Efforts
to incorporate Silicon photonic integrated circuits (PICs) into
advanced CMOS ICs often center on requirements that II-VI or III-V
technologies cannot solely address. Computing, automotive, wellness and
myriad other applications will or are already benefitting from
integrated photonic devices that leverage various silicon or hybrid
technologies. LiDAR is at an inflection point where further advances to
reduce size and increase performance will hinge on new approaches like
those envisioned by researchers at Samsung’s Advanced Institute of Technology who report on SiP advances on the road to better LiDAR PICs.
BY DONGJAE SHIN, KYOUNGHO HA, AND HYUCK CHOO, SAMSUNG ADVANCED INSTITUTE OF TECHNOLOGY
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Edwards Vacuum Interview
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Mark Andrews, Editor of Silicon Semiconductor speaks to Paul Neller, VP of Semiconductor Division Marketing at Edwards Vacuum about the path to Fab sustainability that can increase profits while fighting climate change.
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NEWSLETTER SPONSOR: INFICON
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Find out more: www.inficon.com/ul6000
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ADDITIONAL NEWS
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Silicon ISSUE 3 |
Volume 2022
Silicon Semiconductor Magazine
Featuring: Avoid hydrogen shortages with on-site generation; Electroplating innovation enables ultrafine indium bonding; New micro-textured film enables universal bare die carriers; Plus more...
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Silicon Semiconductor magazine delivers keen insight into new and evolving technologies, and how they shape tomorrow's futures, and fortunes.
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