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Newsletter: 23rd August 2024

 
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FEATURED
Texas Instruments signs preliminary CHIPS Act agreement

Proposed $1.6 billion funding, coupled with an estimated $6 billion to $8 billion in investment tax credit, will help TI provide geopolitically dependable, 300mm capacity for analog and embedded processing semiconductors in Texas and Utah.
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INDUSTRY NEWS
•  Semiconductor Industry Network of Community Colleges launch
•  Researchers show that computer chips have the potential to become even smaller
•  ACC receives $7.5 million grant for semiconductor training
•  NSF awards RIT nearly $3 million to advance semiconductor technologies

View All Industry News
COMPANY NEWS
•  Everspin awarded $14.55m to provide on-shore MRAM manufacturing
•  Ultra Compact Sensor Module for smart air quality monitoring
•  Akeana exits stealth mode with comprehensive RISC-V processor portfolio
•  Advancing semiconductors for the age of AI

View All Company News

SEMI focuses on skills initiatives
Skills, sustainability and market numbers are all covered in this SEMI news update
INTERVIEWS
•  Imec demonstrates logic and DRAM structures using High NA EUV Lithography
•  Sustainability driving change in the semiconductor industry
•  NPUs emerging as GPU alternative in AI applications
•  Resonac unveils new US-JOINT Consortium

View All Interviews
LAB NEWS
•  Researchers show that computer chips have the potential to become even smaller
•  Imec demonstrates logic and DRAM structures using High NA EUV Lithography
•  Paving the way for the semiconductor future
•  Imec achieves record-low charge noise for Si MOS quantum dots

View All Lab News
VIDEO
Wafer bonding moves front and centre

Thomas Uhrmann, director of business development, EV Group, discusses why and how wafer bonding is no longer simply a ba...
Watch Video
NEWSLETTER SPONSOR: EV Group


EVG®880 LayerRelease™ System

EV Group (EVG) is a leading supplier of high-volume production equipment and process solutions for the manufacture of semiconductors, MEMS, compound semiconductors, power devices and nanotechnology devices. A recognized market and technology leader in wafer-level bonding and lithography for advanced packaging and nanotechnology, EVG’s key products include wafer bonding, thin-wafer processing and lithography/nanoimprint lithography (NIL) equipment, photoresist coaters, as well as cleaning and metrology systems.

EVG’s Heterogeneous Integration and NILPhotonics® Competence Centers provide an open access innovation incubator for customers and partners across the microelectronics supply chain.

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Silicon Semiconductor China
Volume 2024 - Issue 04/05
Providing in-depth analysis and timely reports on the global industry for its 10,000 professional readers in China
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