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Newsletter: 12th September 2024

 
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Singapore and India sign MOU on semiconductor ecosystem partnership

Singapore and India exchanged a Memorandum of Understanding (MOU) to partner and cooperate in the field of semiconductors.


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INDUSTRY NEWS
  eBeam Initiative survey predicts photomask growth
  Central State University to spearhead semiconductor research
  Support for semiconductor firms to grow, powering growth in £10bn UK industry
  Intel awarded up to $3B for Secure Enclave
  Industry plans to invest $400 billion in 300mm fab equipment

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COMPANY NEWS
  Heronic Technologies to enter strategic discussions with ROHM
  SONOTEC presents Compact Flow Meter Series at ICPT Conference
  SIAE MICROELETTRONICA selects EnSilica
  Veeco Instruments reduces critical shortages by 50% with LeanDNA
  POET and Mitsubishi Electric collaborate

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ATE testing challenges of heterogeneous silicon chips with advanced packaging
The semiconductor industry is rapidly evolving, driven by the increasing demand for more powerful, efficient, and versatile devices. This evolution has led to the development of complex heterogeneous semiconductor chips with ultra-high density and advanced silicon packages. These cutting-edge designs integrate various functionalities, materials, and technologies onto a single chip, making them incredibly powerful but also posing significant testing challenges in the manufacturing flow. By Sriharsha Vinjamury, Principal Engineer, SOPT, ARM Inc
INTERVIEWS
  Breaking barriers with AI in the semiconductor industry
  Optimising wafer manufacturing yield with proper thermal control
  Silicon photonics promises efficiency and sustainability in the data centre
  Oxford Ionics’ breakthrough promises ‘useful’ quantum computing within three years

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LAB NEWS
  Significant EU funding for VTT's semiconductor development
  Central State University to spearhead semiconductor research
  UTEP establishes collaboration with DoD and NSA
  Purdue receives grant funding in all three areas of NSF semiconductor research program
  Fraunhofer IPMS bids farewell to its long-standing institute director

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VIDEO
POET Technologies plans to ‘semiconductorise’ photonics

Dr. Suresh Venkatesan, Chairman and CEO, POET Technologies, shares the company’s vision to semiconductorise photonics by integrating electronic and photonic components on the POET optical interposer to enable wafer-scale assembly – high volumes at a much faster pace and in a cost-efficient manner. Suresh explains the innovative and scalable platform solution that POET has developed with a particular focus on the role interconnect technology is playing to meet the growing demand of AI in the data centre.

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NEWSLETTER SPONSOR: Applied Energy Systems



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