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Newsletter: 22nd August 2025

 
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Data centre semiconductor trends 2025: AI reshapes compute and memory markets
Yole Group publishes its new report, Data Center Semiconductor Trends 2025, offering an in-depth analysis of how AI, HPC, and hyperscaler demand are driving a new semiconductor paradigm.
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INDUSTRY NEWS
  Council for Science and Technology advocates for UK sovereign AI chip design industry
  2026 IEEE Electronic Components and Technology Conference announces Call for Papers
  Ivan Kissiov of Siemens EDA wins Si2 Pinnacle Award
  Regional nodes to ramp up education
  Dr.-Ing. Karl Busch (1929–2025)

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COMPANY NEWS
  Infineon completes acquisition of Marvell's Automotive Ethernet business
  Changes in management positions at Würth Elektronik eiSos Group
  Alif Semiconductor releases benchmark results from its latest GenAI enabled MCUs
  Arrow Electronics unveils 'world first'
  Advanced WLP and Back-End solutions at SEMICON Taiwan 2025

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Building trust in GenAI for semiconductor design with IP lifecycle management
While Generative AI (GenAI) technologies are already transforming software development and have great potential to improve semiconductor design, their adoption in this industry remains hindered by the challenges around protecting highly sensitive intellectual property (IP), the vast costs associated with errors, and the critical need to manage data provenance and liability. By Vishal Moondhra, VP of Solutions Engineering, Perforce
INTERVIEWS
  SEMI Foundation acts as Coordinating Hub for major US microelectronics initiative
  AI enables co-optimisation of devices and materials
  Removing the barriers to innovation
  Scaling 3D chips with molybdenum-based metallisation

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LAB NEWS
  3D design hub receives $3m funding
  Si2 creates LLM Benchmarking Coalition
  Theory-guided strategy expands the scope of measurable quantum interactions
  Fraunhofer IPMS and DIVE optimise semiconductor processes
  EU Project ELENA pioneers LNOI Platform for next-gen photonic circuits

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VIDEO INTERVIEW


Nitrogen bubbling technology solved poor wet etching uniformity and by-product regrowth

Jim Straus, Vice President of Sales and Leo Archer, Program Director, Technical, both at ACM Research, discuss the recently announced major upgrades to the company’s Ultra C wb cleaning tool, including a patent-pending nitrogen bubbling technology to provide significant wet etching uniformity improvement and e...

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